Datasheet

PIC18F6585/8585/6680/8680
DS30491D-page 466  2003-2013 Microchip Technology Inc.
29.2 Package Details
The following sections give the technical details of the packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
1510515105

Mold Draft Angle Bottom
1510515105

Mold Draft Angle Top
0.270.220.17.011.009.007BLead Width
0.230.180.13.009.007.005
c
Lead Thickness
1616n1Pins per Side
10.1010.009.90.398.394.390D1Molded Package Length
10.1010.009.90.398.394.390E1Molded Package Width
12.2512.0011.75.482.472.463DOverall Length
12.2512.0011.75.482.472.463EOverall Width
73.5073.50

Foot Angle
0.750.600.45.030.024.018LFoot Length
0.250.150.05.010.006.002A1Standoff §
1.051.000.95.041.039
.037A2Molded Package Thickness
1.201.101.00.047.043.039AOverall Height
0.50.020
p
Pitch
6464
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
c
2
1
n
DD1
B
p
#leads=n1
E1
E
A2
A1
A
L
CH x 45




(F)
Footprint (Reference)
(F)
.039 1.00
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
18F8680.book Page 466 Tuesday, January 29, 2013 1:32 PM