Datasheet

PIC18F6390/6490/8390/8490
DS39629C-page 360 © 2007 Microchip Technology Inc.
Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔILCD, ΔIOSCB, ΔIAD)
D022
(ΔI
WDT)
Watchdog Timer 1.7 4 μA -40°C
2.1 4 μA +25°C V
DD = 2.0V
2.6 5 μA +85°C
2.2 6 μA -40°C
2.4 6 μA +25°C V
DD = 3.0V
2.8 7 μA +85°C
2.9 10 μA -40°C
3.1 10 μA +25°C V
DD = 5.0V
3.3 13 μA +85°C
D022A
(ΔI
BOR)
Brown-out Reset 17 50 μA-40°C to
+85°C
V
DD = 3.0V
42 60 μA-40°C to
+85°C
V
DD = 5.0V
D022B
(ΔI
LVD)
High/Low-Voltage Detect 14 38 μA-40°C to
+85°C
V
DD = 2.0V
18 40 μA-40°C to
+85°C
V
DD = 3.0V
21 45 μA-40°C to
+85°C
V
DD = 5.0V
D024
(ΔI
LCD)
LCD Module 1.5 3 μA -40°C
V
DD = 2.0V
LCD on INTRC clock,
LCD segments enabled.
1.5 3 μA +25°C
1.7 4 μA +85°C
2.2 5 μA -40°C
V
DD = 3.0V
LCD on INTRC clock,
LCD segments enabled.
2.5 5 μA +25°C
2.7 6 μA +85°C
6.1 10 μA -40°C
V
DD = 5.0V
LCD on INTRC clock,
LCD segments enabled.
6.5 10 μA +25°C
7.2 10 μA +85°C
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F6390/6490/8390/8490 (Industrial)
PIC18LF6390/6490/8390/8490 (Industrial) (Continued)
PIC18LF6390/6490/8390/8490
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F6390/6490/8390/8490
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: Low-power Timer1 oscillator selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.