Datasheet
PIC18F6310/6410/8310/8410
DS39635C-page 358 2010 Microchip Technology Inc.
Supply Current (I
DD)
(2,3)
PIC18LFX310/X410 250 500 A -40°C
V
DD = 2.0V
F
OSC = 1 MHZ
(PRI_RUN,
EC oscillator)
260 500 A +25°C
250 500 A +85°C
PIC18LFX310/X410 550 650 A -40°C
V
DD = 3.0V480 650 A +25°C
460 650 A +85°C
All devices 1.2 1.6 mA -40°C
V
DD = 5.0V
1.1 1.5 mA +25°C
1.0 1.4 mA +85°C
1.5 1.9 mA +125°C
PIC18LFX310/X410 0.72 2.0 mA -40°C
V
DD = 2.0V
F
OSC = 4 MHz
(PRI_RUN,
EC oscillator)
0.74 2.0 mA +25°C
0.74 2.0 mA +85°C
PIC18LFX310/X410 1.3 3.0 mA -40°C
V
DD = 3.0V1.3 3.0 mA +25°C
1.3 3.0 mA +85°C
All devices 2.7 6.0 mA -40°C
V
DD = 5.0V
2.6 6.0 mA +25°C
2.5 6.0 mA +85°C
4.2 8 mA +125°C
All devices 15 35 mA -40°C
V
DD = 4.2V
F
OSC = 40 MHZ
(PRI_RUN,
EC oscillator)
16 35 mA +25°C
16 35 mA +85°C
All devices 21 40 mA -40°C
V
DD = 5.0V
21 40 mA +25°C
21 40 mA +85°C
30 50 mA +125°C
27.2 DC Characteristics: Power-Down and Supply Current
PIC18F6310/6410/8310/8410 (Industrial, Extended)
PIC18LF6310/6410/8310/8410 (Industrial) (Continued)
PIC18LF6310/6410/8310/8410
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
PIC18F6310/6410/8310/8410
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
-40°C T
A +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the
part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS, and all features that add delta current
disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and
switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the cur-
rent consumption. The test conditions for all I
DD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins are tri-stated, pulled to V
DD or VSS; MCLR = VDD; WDT is enabled/disabled as specified.
3: When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than
the sum of both specifications.