Datasheet

 2010 Microchip Technology Inc. DS39635C-page 357
PIC18F6310/6410/8310/8410
Supply Current (IDD)
(2,3)
PIC18LFX310/X410 2.3 6.4 A -40°C
V
DD = 2.0V
F
OSC = 31 kHz
(RC_IDLE mode,
Internal oscillator source)
2.5 6.4 A +25°C
2.9 8.8 A +85°C
PIC18LFX310/X410 3.6 8.8 A -40°C
V
DD = 3.0V3.8 8.8 A +25°C
4.6 12 A +85°C
All devices 7.4 16 A -40°C
V
DD = 5.0V
7.8 13 A +25°C
9.1 29 A +85°C
21 97 A +125°C
PIC18LFX310/X410 132 450 A -40°C
V
DD = 2.0V
F
OSC = 1 MHz
(RC_IDLE mode,
Internal oscillator source)
140 450 A +25°C
152 450 A +85°C
PIC18LFX310/X410 200 600 A -40°C
V
DD = 3.0V216 600 A +25°C
252 600 A +85°C
All devices 400 990 A -40°C
V
DD = 5.0V
420 990 A +25°C
440 990 A +85°C
850 1.2 A +125°C
PIC18LFX310/X410 272 690 A -40°C
V
DD = 2.0V
F
OSC = 4 MHz
(RC_IDLE mode,
Internal oscillator source)
280 690 A +25°C
288 690 A +85°C
PIC18LFX310/X410 416 990 A -40°C
V
DD = 3.0V432 990 A +25°C
464 990 A +85°C
All devices .8 1.9 mA -40°C
V
DD = 5.0V
.9 1.9 mA +25°C
.9 1.9 mA +85°C
1.6 2.2 mA +125°C
27.2 DC Characteristics: Power-Down and Supply Current
PIC18F6310/6410/8310/8410 (Industrial, Extended)
PIC18LF6310/6410/8310/8410 (Industrial) (Continued)
PIC18LF6310/6410/8310/8410
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +85°C for industrial
PIC18F6310/6410/8310/8410
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +85°C for industrial
-40°C  T
A  +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the
part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS, and all features that add delta current
disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and
switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the cur-
rent consumption. The test conditions for all I
DD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins are tri-stated, pulled to V
DD or VSS; MCLR = VDD; WDT is enabled/disabled as specified.
3: When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than
the sum of both specifications.