Datasheet
PIC18F6310/6410/8310/8410
DS39635C-page 356 2010 Microchip Technology Inc.
Supply Current (I
DD)
(2,3)
PIC18LFX310/X410 12 26 A -40°C
V
DD = 2.0V
F
OSC = 31 kHz
(RC_RUN mode,
Internal oscillator source)
12 24 A +25°C
12 23 A +85°C
PIC18LFX310/X410 32 50 A -40°C
V
DD = 3.0V27 48 A +25°C
22 46 A +85°C
All devices 84 134 A -40°C
V
DD = 5.0V
82 128 A +25°C
72 122 A +85°C
90 145 A 125°C
PIC18LFX310/X410 .26 .8 mA -40°C
V
DD = 2.0V
F
OSC = 1 MHz
(RC_RUN mode,
Internal oscillator source)
.26 .8 mA +25°C
.26 .8 mA +85°C
PIC18LFX310/X410 .48 1.04 mA -40°C
V
DD = 3.0V.44 .96 mA +25°C
.48 .88 mA +85°C
All devices .88 1.84 mA -40°C
V
DD = 5.0V
.88 1.76 mA +25°C
.8 1.68 mA +85°C
1.25 2.2 mA +125°C
PIC18LFX310/X410 0.6 1.7 mA -40°C
V
DD = 2.0V
F
OSC = 4 MHz
(RC_RUN mode,
Internal oscillator source)
0.6 1.6 mA +25°C
0.6 1.5 mA +85°C
PIC18LFX310/X410 1.0 2.4 mA -40°C
V
DD = 3.0V1.0 2.4 mA +25°C
1.0 2.4 mA +85°C
All devices 2.0 4.2 mA -40°C
V
DD = 5.0V
2.0 4 mA +25°C
2.0 3.8 mA +85°C
2.7 4.3 mA +125°C
27.2 DC Characteristics: Power-Down and Supply Current
PIC18F6310/6410/8310/8410 (Industrial, Extended)
PIC18LF6310/6410/8310/8410 (Industrial) (Continued)
PIC18LF6310/6410/8310/8410
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
PIC18F6310/6410/8310/8410
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
-40°C T
A +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the
part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS, and all features that add delta current
disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and
switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the cur-
rent consumption. The test conditions for all I
DD measurements in active operation mode are: OSC1 = external square wave,
from rail-to-rail; all I/O pins are tri-stated, pulled to V
DD or VSS; MCLR = VDD; WDT is enabled/disabled as specified.
3: When operation below -10°C is expected, use the T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than
the sum of both specifications.