Datasheet

ManualsBrandsMICROCHIP TECHNOLOGY ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller PDIP 40 8-Bit 40 MHz I/O number 36

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Table Of Contents

Power Management Features:
Flexible Oscillator Structure:
Peripheral Highlights:
Peripheral Highlights (Continued):
Special Microcontroller Features:
Pin Diagrams
Pin Diagrams (Cont.’d)
Table of Contents
Most Current Data Sheet
Errata
Customer Notification System
1.0 Device Overview
- 1.1 New Core Features
  - 1.1.1 nanoWatt Technology
  - 1.1.2 Multiple Oscillator Options and Features
- 1.2 Other Special Features
- 1.3 Details on Individual Family Members
2.0 Oscillator Configurations
- 2.1 Oscillator Types
- 2.2 Crystal Oscillator/Ceramic Resonators
- 2.3 External Clock Input
  - FIGURE 2-3: External Clock Input Operation (EC Configuration)
  - FIGURE 2-4: External Clock Input Operation (ECIO Configuration)
- 2.4 RC Oscillator
  - FIGURE 2-5: RC Oscillator Mode
  - FIGURE 2-6: RCIO Oscillator Mode
- 2.5 PLL Frequency Multiplier
  - 2.5.1 HSPLL Oscillator Mode
    - FIGURE 2-7: PLL Block Diagram (HS Mode)
  - 2.5.2 PLL and INTOSC
- 2.6 Internal Oscillator Block
- 2.7 Clock Sources and Oscillator Switching
- 2.8 Effects of Power-Managed Modes on the Various Clock Sources
- 2.9 Power-up Delays
  - TABLE 2-3: OSC1 and OSC2 Pin States in Sleep Mode
3.0 Power-Managed Modes
- 3.1 Selecting Power-Managed Modes
- 3.2 Run Modes
- 3.3 Sleep Mode
- 3.4 Idle Modes
- 3.5 Exiting Idle and Sleep Modes
4.0 Reset
- 4.1 RCON Register
  - FIGURE 4-1: Simplified Block Diagram of On-Chip Reset Circuit
  - Register 4-1: RCON: Reset Control Register
- 4.2 Master Clear (MCLR)
- 4.3 Power-on Reset (POR)
  - FIGURE 4-2: External Power-on Reset Circuit (for Slow Vdd Power-up)
- 4.4 Brown-out Reset (BOR)
- 4.5 Device Reset Timers
- 4.6 Reset State of Registers
  - TABLE 4-3: Status Bits, Their Significance and the Initialization Condition for RCON Register
  - TABLE 4-4: Initialization Conditions for All Registers
5.0 Memory Organization
- 5.1 Program Memory Organization
- 5.2 PIC18 Instruction Cycle
- 5.3 Data Memory Organization
- 5.4 Data Addressing Modes
- 5.5 Data Memory and the Extended Instruction Set
- 5.6 PIC18 Instruction Execution and the Extended Instruction Set
  - FIGURE 5-9: Remapping the Access Bank with Indexed Literal Offset Addressing Mode
6.0 Data EEPROM Memory
- 6.1 EEADR and EEADRH Registers
- 6.2 EECON1 and EECON2 Registers
  - Register 6-1: EECON1: EEPROM Control Register 1
- 6.3 Reading the Data EEPROM Memory
- 6.4 Writing to the Data EEPROM Memory
- 6.5 Write Verify
  - EXAMPLE 6-1: Data EEPROM Read
  - EXAMPLE 6-2: Data EEPROM Write
- 6.6 Operation During Code-Protect
- 6.7 Protection Against Spurious Write
- 6.8 Using the Data EEPROM
  - EXAMPLE 6-3: Data EEPROM Refresh Routine
  - TABLE 6-1: Registers Associated with Data EEPROM Memory
7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
  - FIGURE 7-1: Table Read Operation
  - FIGURE 7-2: Table Write Operation
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
  - FIGURE 7-4: Reads From Flash Program Memory
  - EXAMPLE 7-1: Reading a Flash Program Memory Word
- 7.4 Erasing Flash Program Memory
  - 7.4.1 Flash Program Memory Erase Sequence
    - EXAMPLE 7-2: Erasing a Flash Program Memory Row
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
  - TABLE 7-2: Registers Associated with Program Flash Memory
8.0 8 X 8 Hardware Multiplier
- 8.1 Introduction
- 8.2 Operation
9.0 I/O Ports
- FIGURE 9-1: Generic I/O Port Operation
- 9.1 PORTA, TRISA and LATA Registers
- 9.2 PORTB, TRISB and LATB Registers
- 9.3 PORTC, TRISC and LATC Registers
- 9.4 PORTD, TRISD and LATD Registers
- 9.5 PORTE, TRISE and LATE Registers
  - EXAMPLE 9-5: Initializing PORTE
  - 9.5.1 PORTE in 28-Pin Devices
- 9.6 Parallel Slave Port
10.0 Interrupts
- FIGURE 10-1: PIC18 Interrupt Logic
- 10.1 INTCON Registers
- 10.2 PIR Registers
  - Register 10-4: PIR1: Peripheral Interrupt Request (Flag) Register 1
  - Register 10-5: PIR2: Peripheral Interrupt Request (Flag) Register 2
- 10.3 PIE Registers
  - Register 10-6: PIE1: Peripheral Interrupt Enable Register 1
  - Register 10-7: PIE2: Peripheral Interrupt Enable Register 2
- 10.4 IPR Registers
  - Register 10-8: IPR1: Peripheral Interrupt Priority Register 1
  - Register 10-9: IPR2: Peripheral Interrupt Priority Register 2
- 10.5 RCON Register
  - Register 10-10: RCON: Reset Control Register
- 10.6 INTx Pin Interrupts
- 10.7 TMR0 Interrupt
- 10.8 PORTB Interrupt-on-Change
- 10.9 Context Saving During Interrupts
  - EXAMPLE 10-1: Saving STATUS, WREG and BSR Registers in RAM
11.0 Timer0 Module
- Register 11-1: T0CON: Timer0 Control Register
- 11.1 Timer0 Operation
- 11.2 Timer0 Reads and Writes in 16-Bit Mode
  - FIGURE 11-1: Timer0 Block Diagram (8-Bit Mode)
  - FIGURE 11-2: Timer0 Block Diagram (16-Bit Mode)
- 11.3 Prescaler
  - 11.3.1 Switching Prescaler Assignment
- 11.4 Timer0 Interrupt
  - TABLE 11-1: Registers Associated with Timer0
12.0 Timer1 Module
- Register 12-1: T1CON: Timer1 Control Register
- 12.1 Timer1 Operation
  - FIGURE 12-1: Timer1 Block Diagram
  - FIGURE 12-2: Timer1 Block Diagram (16-Bit Read/Write Mode)
- 12.2 Timer1 16-Bit Read/Write Mode
- 12.3 Timer1 Oscillator
- 12.4 Timer1 Interrupt
- 12.5 Resetting Timer1 Using the CCP Special Event Trigger
- 12.6 Using Timer1 as a Real-Time Clock
  - EXAMPLE 12-1: Implementing a Real-Time Clock Using a Timer1 Interrupt Service
  - TABLE 12-2: Registers Associated with Timer1 as a Timer/Counter
13.0 Timer2 Module
- 13.1 Timer2 Operation
  - Register 13-1: T2CON: Timer2 Control Register
- 13.2 Timer2 Interrupt
- 13.3 Timer2 Output
  - FIGURE 13-1: Timer2 Block Diagram
  - TABLE 13-1: Registers Associated with Timer2 as a Timer/Counter
14.0 Timer3 Module
- Register 14-1: T3CON: Timer3 Control Register
- 14.1 Timer3 Operation
  - FIGURE 14-1: Timer3 Block Diagram
  - FIGURE 14-2: Timer3 Block Diagram (16-Bit Read/Write Mode)
- 14.2 Timer3 16-Bit Read/Write Mode
- 14.3 Using the Timer1 Oscillator as the Timer3 Clock Source
- 14.4 Timer3 Interrupt
- 14.5 Resetting Timer3 Using the CCP Special Event Trigger
  - TABLE 14-1: Registers Associated with Timer3 as a Timer/Counter
15.0 Capture/Compare/PWM (CCP) Modules
- Register 15-1: CCPxCON: CCPx Control Register (28-Pin Devices)
- 15.1 CCP Module Configuration
  - 15.1.1 CCP Modules and Timer Resources
    - TABLE 15-1: CCP Mode – Timer Resources
  - 15.1.2 CCP2 Pin Assignment
    - TABLE 15-2: Interactions Between CCP1 and CCP2 for Timer Resources
- 15.2 Capture Mode
- 15.3 Compare Mode
- 15.4 PWM Mode
16.0 Enhanced Capture/ Compare/PWM (ECCP) Module
- Register 16-1: CCP1CON: ECCP Control Register (40/44-Pin Devices)
- 16.1 ECCP Outputs and Configuration
  - 16.1.1 ECCP Modules and Timer Resources
- 16.2 Capture and Compare Modes
  - 16.2.1 Special Event Trigger
- 16.3 Standard PWM Mode
  - TABLE 16-1: Pin Assignments for Various ECCP1 Modes
- 16.4 Enhanced PWM Mode
17.0 Master Synchronous Serial Port (MSSP) Module
- 17.1 Master SSP (MSSP) Module Overview
- 17.2 Control Registers
- 17.3 SPI Mode
- 17.4 I2C Mode
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)
- Register 18-1: TXSTA: Transmit Status And Control Register
- Register 18-2: RCSTA: Receive Status And Control Register
- Register 18-3: BAUDCON: Baud Rate Control Register
- 18.1 Baud Rate Generator (BRG)
- 18.2 EUSART Asynchronous Mode
- 18.3 EUSART Synchronous Master Mode
  - 18.3.1 EUSART Synchronous Master Transmission
  - 18.3.2 EUSART Synchronous Master Reception
    - FIGURE 18-13: Synchronous Reception (Master Mode, SREN)
    - TABLE 18-8: Registers Associated with Synchronous Master Reception
- 18.4 EUSART Synchronous Slave Mode
  - 18.4.1 EUSART Synchronous Slave Transmission
    - TABLE 18-9: Registers Associated with Synchronous Slave Transmission
  - 18.4.2 EUSART Synchronous Slave Reception
    - TABLE 18-10: Registers Associated with Synchronous Slave Reception
19.0 10-Bit Analog-to-Digital Converter (A/D) Module
- Register 19-1: ADCON0: A/D Control Register 0
- Register 19-2: ADCON1: A/D Control Register 1
- Register 19-3: ADCON2: A/D Control Register 2
- FIGURE 19-1: A/D Block Diagram
- FIGURE 19-2: A/D Transfer Function
- FIGURE 19-3: Analog Input Model
- 19.1 A/D Acquisition Requirements
- 19.2 Selecting and Configuring Acquisition Time
- 19.3 Selecting the A/D Conversion Clock
  - TABLE 19-1: Tad vs. Device Operating Frequencies
- 19.4 Operation in Power-Managed Modes
- 19.5 Configuring Analog Port Pins
- 19.6 A/D Conversions
- 19.7 Discharge
  - FIGURE 19-4: A/D Conversion Tad Cycles (ACQT<2:0> = 000, Tacq = 0)
  - FIGURE 19-5: A/D Conversion Tad Cycles (ACQT<2:0> = 010, Tacq = 4 Tad)
- 19.8 Use of the CCP2 Trigger
  - TABLE 19-2: Registers Associated with A/D Operation
20.0 Comparator Module
- Register 20-1: CMCON: Comparator Control Register
- 20.1 Comparator Configuration
  - FIGURE 20-1: Comparator I/O Operating Modes
- 20.2 Comparator Operation
- 20.3 Comparator Reference
- 20.4 Comparator Response Time
- 20.5 Comparator Outputs
  - FIGURE 20-3: Comparator Output Block Diagram
- 20.6 Comparator Interrupts
- 20.7 Comparator Operation During Sleep
- 20.8 Effects of a Reset
- 20.9 Analog Input Connection Considerations
  - FIGURE 20-4: Comparator Analog Input Model
  - TABLE 20-1: Registers Associated with Comparator Module
21.0 Comparator Voltage Reference Module
- 21.1 Configuring the Comparator Voltage Reference
  - Register 21-1: CVRCON: Comparator Voltage Reference Control Register
  - FIGURE 21-1: Comparator Voltage Reference Block Diagram
- 21.2 Voltage Reference Accuracy/Error
- 21.3 Operation During Sleep
- 21.4 Effects of a Reset
- 21.5 Connection Considerations
  - FIGURE 21-2: Voltage Reference Output Buffer Example
  - TABLE 21-1: Registers Associated with Comparator Voltage Reference
22.0 High/Low-Voltage Detect (HLVD)
- Register 22-1: HLVDCON: High/Low-Voltage Detect Control Register
- 22.1 Operation
  - FIGURE 22-1: HLVD Module Block Diagram (with External Input)
- 22.2 HLVD Setup
- 22.3 Current Consumption
- 22.4 HLVD Start-up Time
  - FIGURE 22-2: Low-Voltage Detect Operation (VDIRMAG = 0)
  - FIGURE 22-3: High-Voltage Detect Operation (VDIRMAG = 1)
- 22.5 Applications
  - FIGURE 22-4: Typical Low-Voltage Detect Application
- 22.6 Operation During Sleep
- 22.7 Effects of a Reset
  - TABLE 22-1: Registers Associated with High/Low-Voltage Detect Module
23.0 Special Features of the CPU
- 23.1 Configuration Bits
- 23.2 Watchdog Timer (WDT)
  - 23.2.1 Control Register
- 23.3 Two-Speed Start-up
  - 23.3.1 Special Considerations for Using Two-Speed Start-up
    - FIGURE 23-2: Timing Transition for Two-Speed Start-up (INTOSC to HSPLL)
- 23.4 Fail-Safe Clock Monitor
- 23.5 Program Verification and Code Protection
- 23.6 ID Locations
- 23.7 In-Circuit Serial Programming
- 23.8 In-Circuit Debugger
  - TABLE 23-4: Debugger Resources
- 23.9 Single-Supply ICSP Programming
24.0 Instruction Set Summary
- 24.1 Standard Instruction Set
- 24.2 Extended Instruction Set
25.0 Development Support
- 25.1 MPLAB Integrated Development Environment Software
- 25.2 MPASM Assembler
- 25.3 MPLAB C18 and MPLAB C30 C Compilers
- 25.4 MPLINK Object Linker/ MPLIB Object Librarian
- 25.5 MPLAB ASM30 Assembler, Linker and Librarian
- 25.6 MPLAB SIM Software Simulator
- 25.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 25.8 MPLAB REAL ICE In-Circuit Emulator System
- 25.9 MPLAB ICD 2 In-Circuit Debugger
- 25.10 MPLAB PM3 Device Programmer
- 25.11 PICSTART Plus Development Programmer
- 25.12 PICkit 2 Development Programmer
- 25.13 Demonstration, Development and Evaluation Boards
26.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 26.1 DC Characteristics: Supply Voltage PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.3 DC Characteristics: PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.4 AC (Timing) Characteristics
27.0 DC and AC Characteristics Graphs and Tables
- FIGURE 27-1: Sleep Mode
- FIGURE 27-2: Typical Ipd vs. Vdd Across Temperature (Sleep Mode)
- FIGURE 27-3: Maximum Ipd vs. Vdd Across Temperature (Sleep Mode)
- FIGURE 27-4: Typical T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in Low-Power Mode)
- FIGURE 27-5: Maximum T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, TIOSC in Low-Power Mode)
- FIGURE 27-6: Typical T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in High-Power Mode)
- FIGURE 27-7: Maximum T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in High-Power Mode)
- FIGURE 27-8: Typical BOR Delta Current vs. Vdd Across Temp. (BORV = 2.7V, Sleep Mode)
- FIGURE 27-9: Typical WDT Current vs. Vdd Across Temperature (WDT Delta Current in Sleep Mode)
- FIGURE 27-10: Maximum WDT Current vs. Vdd Across Temperature (WDT Delta Current in Sleep Mode)
- FIGURE 27-11: Typical Idd Across Vdd (RC_RUN Mode, 25°C)
- FIGURE 27-12: Maximum Idd Across Vdd (RC_RUN Mode, 85°C)
- FIGURE 27-13: Typical and Maximum Idd Across Vdd (RC_RUN Mode, 31 kHz)
- FIGURE 27-14: Typical Idd Across Vdd (RC_IDLE Mode, 25°C)
- FIGURE 27-15: Maximum Idd Across Vdd (RC_IDLE Mode, -40°C-85°C)
- FIGURE 27-16: Typical and Maximum Idd Across Vdd (RC_IDLE Mode, 31 kHz)
- FIGURE 27-17: Typical and Maximum SEC_RUN Current vs. Vdd Across Temperature (T1OSC in Low-Power Mode)
- FIGURE 27-18: Typical and Maximum SEC_IDLE Current vs. Vdd Across Temperature (T1OSC in Low-Power Mode)
- FIGURE 27-19: Typical Idd vs. Fosc, 500 kHz to 4 MHz (PRI_RUN Mode (EC Clock), 25°C)
- FIGURE 27-20: Maximum Idd vs. Fosc, 500 kHz to 4 MHz (PRI_RUN Mode (EC Clock), -40°C to +125°C)
- FIGURE 27-21: Typical Idd vs. Fosc, 4 MHz to 40 MHz (PRI_RUN Mode (EC Clock), 25°C)
- FIGURE 27-22: Maximum Idd vs. Fosc, 4 MHz to 40 MHz (PRI_RUN Mode (EC Clock), -40°C to +125°C)
- FIGURE 27-23: Typical Idd vs. Fosc, HS/PLL (PRI_RUN Mode, 25°C)
- FIGURE 27-24: Maximum Idd vs. Fosc, HS/PLL (PRI_RUN Mode, -40°C)
- FIGURE 27-25: Typical Idd vs. Fosc, 500 kHz to 4 MHz (PRI_IDLE Mode, 25°C)
- FIGURE 27-26: Maximum Idd vs. Fosc, 500 kHz to 4 MHz (PRI_IDLE Mode, -40°C to +125°C)
- FIGURE 27-27: Typical Idd vs. Fosc, 4 MHz to 40 MHz (PRI_IDLE Mode, 25°C)
- FIGURE 27-28: Maximum Idd vs. Fosc, 4 MHz to 40 MHz (PRI_IDLE Mode, -40°C to +125°C)
- FIGURE 27-29: Typical Idd vs. Fosc, HS/PLL (PRI_IDLE Mode, 25°C)
- FIGURE 27-30: Maximum Idd vs. Fosc, HS/PLL (PRI_IDLE Mode, -40°C)
- FIGURE 27-31: Vin (ST) vs. Vdd, 25°C (-40°C to +125°C)
- FIGURE 27-32: Vin (TTL) vs. Vdd, 25°C (-40°C to +125°C)
- FIGURE 27-33: Vol vs. Iol (Vdd = 3.0V, -40°C to +85°C)
- FIGURE 27-34: Vol vs. Iol (Vdd = 5.0V, -40°C to +125°C)
- FIGURE 27-35: Voh vs. Ioh (Vdd = 3.0V, -40°C to +85°C)
- FIGURE 27-36: Voh vs. Ioh (Vdd = 5.0V, -40°C to +125°C)
- FIGURE 27-37: INTOSC Frequency vs. Vdd, Temperature (-40°C, +25°C, +85°C, +125°C)
- FIGURE 27-38: INTRC vs. Vdd Across Temperature (-40°C to +125°C)
- FIGURE 27-39: WDT Period vs. Vdd Across Temperature (1:1 Postscaler, -40°C to +125°C)
28.0 Packaging Information
- 28.1 Package Marking Information
- 28.1 Package Marking Information (Continued)
- 28.2 Package Details
Appendix A: Revision History
- Revision A (April 2004)
- Revision B (June 2004)
- Revision C (January 2007)
- Revision D (November 2007)
- Revision E (May 2008)
Appendix B: Device Differences
- TABLE B-1: Device Differences
Appendix C: Conversion Considerations
Appendix D: Migration from Baseline to Enhanced Devices
Appendix E: Migration from Mid-Range TO Enhanced Devices
Appendix F: Migration from High-End to Enhanced Devices
INDEX
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PIC18F2525/2620/4525/4620

FIGURE 26-13: EXAMPLE SPI MASTER MODE TIMING (CKE = 0)

TABLE 26-14: EXAMPLE SPI MODE REQUIREMENTS (MASTER MODE, CKE = 0)

SCK

(CKP = 0)

SCK

(CKP = 1)

SDO

SDI

71 72

75, 76

MSb LSb

bit 6 - - - - - -1

MSb In

LSb In

bit 6 - - - -1

Note: Refer to Figure 26-5 for load conditions.

Param

No.

Symbol Characteristic Min Max Units Conditions

70 TssL2scH,

TssL2scL

↓ to SCK ↓ or SCK ↑ Input TCY —ns

71 TscH SCK Input High Time

(Slave mode)

Continuous 1.25 T

CY + 30 — ns

71A Single Byte 40 — ns (Note 1)

72 TscL SCK Input Low Time

(Slave mode)

Continuous 1.25 T

CY + 30 — ns

72A Single Byte 40 — ns (Note 1)

73 TdiV2scH,

TdiV2scL

Setup Time of SDI Data Input to SCK Edge 20 — ns

73A Tb2b Last Clock Edge of Byte 1 to the 1st Clock Edge

of Byte 2

1.5 T

CY + 40 — ns (Note 2)

74 TscH2diL,

TscL2diL

Hold Time of SDI Data Input to SCK Edge 40 — ns

75 TdoR SDO Data Output Rise Time PIC18FXXXX — 25 ns

PIC18LFXXXX — 45 ns V

DD = 2.0V

76 TdoF SDO Data Output Fall Time — 25 ns

78 TscR SCK Output Rise Time

(Master mode)

PIC18FXXXX — 25 ns

PIC18LFXXXX — 45 ns V

DD = 2.0V

79 TscF SCK Output Fall Time (Master mode) — 25 ns

80 TscH2doV,

TscL2doV

SDO Data Output Valid after

SCK Edge

PIC18FXXXX — 50 ns

PIC18LFXXXX — 100 ns V

DD = 2.0V

Note 1: Requires the use of Parameter #73A.

2: Only if Parameter #71A and #72A are used.