Datasheet
Table Of Contents
- Power Management Features:
- Flexible Oscillator Structure:
- Peripheral Highlights:
- Peripheral Highlights (Continued):
- Special Microcontroller Features:
- Pin Diagrams
- Pin Diagrams (Cont.’d)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Oscillator Configurations
- 3.0 Power-Managed Modes
- 4.0 Reset
- 4.1 RCON Register
- 4.2 Master Clear (MCLR)
- 4.3 Power-on Reset (POR)
- 4.4 Brown-out Reset (BOR)
- 4.5 Device Reset Timers
- 4.5.1 Power-up Timer (PWRT)
- 4.5.2 Oscillator Start-up Timer (OST)
- 4.5.3 PLL Lock Time-out
- 4.5.4 Time-out Sequence
- TABLE 4-2: Time-out in Various Situations
- FIGURE 4-3: Time-out Sequence on Power-up (MCLR Tied to Vdd, Vdd Rise < Tpwrt)
- FIGURE 4-4: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 1
- FIGURE 4-5: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 2
- FIGURE 4-6: Slow Rise Time (MCLR Tied to Vdd, Vdd Rise > Tpwrt)
- FIGURE 4-7: Time-out Sequence on POR w/PLL Enabled (MCLR Tied to Vdd)
- 4.6 Reset State of Registers
- 5.0 Memory Organization
- 5.1 Program Memory Organization
- 5.2 PIC18 Instruction Cycle
- 5.3 Data Memory Organization
- 5.4 Data Addressing Modes
- 5.5 Data Memory and the Extended Instruction Set
- 5.6 PIC18 Instruction Execution and the Extended Instruction Set
- 6.0 Data EEPROM Memory
- 7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
- 7.4 Erasing Flash Program Memory
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
- 8.0 8 X 8 Hardware Multiplier
- 8.1 Introduction
- 8.2 Operation
- EXAMPLE 8-1: 8 x 8 Unsigned Multiply Routine
- EXAMPLE 8-2: 8 x 8 Signed Multiply Routine
- TABLE 8-1: Performance Comparison for Various Multiply Operations
- EQUATION 8-1: 16 x 16 Unsigned Multiplication Algorithm
- EXAMPLE 8-3: 16 x 16 Unsigned Multiply Routine
- EQUATION 8-2: 16 x 16 Signed Multiplication Algorithm
- EXAMPLE 8-4: 16 x 16 Signed Multiply Routine
- 9.0 I/O Ports
- 10.0 Interrupts
- 11.0 Timer0 Module
- 12.0 Timer1 Module
- 13.0 Timer2 Module
- 14.0 Timer3 Module
- 15.0 Capture/Compare/PWM (CCP) Modules
- Register 15-1: CCPxCON: CCPx Control Register (28-Pin Devices)
- 15.1 CCP Module Configuration
- 15.2 Capture Mode
- 15.3 Compare Mode
- 15.4 PWM Mode
- 16.0 Enhanced Capture/ Compare/PWM (ECCP) Module
- Register 16-1: CCP1CON: ECCP Control Register (40/44-Pin Devices)
- 16.1 ECCP Outputs and Configuration
- 16.2 Capture and Compare Modes
- 16.3 Standard PWM Mode
- 16.4 Enhanced PWM Mode
- 16.4.1 PWM Period
- 16.4.2 PWM Duty Cycle
- 16.4.3 PWM Output Configurations
- 16.4.4 Half-Bridge Mode
- 16.4.5 Full-Bridge Mode
- 16.4.6 Programmable Dead-Band Delay
- 16.4.7 Enhanced PWM Auto-Shutdown
- 16.4.8 Start-up Considerations
- 16.4.9 Setup for PWM Operation
- 16.4.10 Operation in Power-Managed Modes
- 16.4.11 Effects of a Reset
- 17.0 Master Synchronous Serial Port (MSSP) Module
- 17.1 Master SSP (MSSP) Module Overview
- 17.2 Control Registers
- 17.3 SPI Mode
- 17.4 I2C Mode
- FIGURE 17-7: MSSP Block Diagram (I2C™ Mode)
- 17.4.1 Registers
- 17.4.2 Operation
- 17.4.3 Slave Mode
- 17.4.4 Clock Stretching
- 17.4.5 General Call Address Support
- 17.4.6 Master Mode
- 17.4.7 Baud Rate
- 17.4.8 I2C Master Mode Start Condition Timing
- 17.4.9 I2C Master Mode Repeated Start Condition Timing
- 17.4.10 I2C Master Mode Transmission
- 17.4.11 I2C Master Mode Reception
- 17.4.12 Acknowledge Sequence Timing
- 17.4.13 Stop Condition Timing
- 17.4.14 Sleep Operation
- 17.4.15 Effects of a Reset
- 17.4.16 Multi-Master Mode
- 17.4.17 Multi -Master Communication, Bus Collision and Bus Arbitration
- FIGURE 17-25: Bus Collision Timing for Transmit and Acknowledge
- FIGURE 17-26: Bus Collision During Start Condition (SDA Only)
- FIGURE 17-27: Bus Collision During Start Condition (SCL = 0)
- FIGURE 17-28: BRG Reset Due to SDA Arbitration During Start Condition
- FIGURE 17-29: Bus Collision During a Repeated Start Condition (Case 1)
- FIGURE 17-30: Bus Collision During Repeated Start Condition (Case 2)
- FIGURE 17-31: Bus Collision During a Stop Condition (Case 1)
- FIGURE 17-32: Bus Collision During a Stop Condition (Case 2)
- 18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)
- Register 18-1: TXSTA: Transmit Status And Control Register
- Register 18-2: RCSTA: Receive Status And Control Register
- Register 18-3: BAUDCON: Baud Rate Control Register
- 18.1 Baud Rate Generator (BRG)
- 18.2 EUSART Asynchronous Mode
- 18.3 EUSART Synchronous Master Mode
- 18.4 EUSART Synchronous Slave Mode
- 19.0 10-Bit Analog-to-Digital Converter (A/D) Module
- Register 19-1: ADCON0: A/D Control Register 0
- Register 19-2: ADCON1: A/D Control Register 1
- Register 19-3: ADCON2: A/D Control Register 2
- FIGURE 19-1: A/D Block Diagram
- FIGURE 19-2: A/D Transfer Function
- FIGURE 19-3: Analog Input Model
- 19.1 A/D Acquisition Requirements
- 19.2 Selecting and Configuring Acquisition Time
- 19.3 Selecting the A/D Conversion Clock
- 19.4 Operation in Power-Managed Modes
- 19.5 Configuring Analog Port Pins
- 19.6 A/D Conversions
- 19.7 Discharge
- 19.8 Use of the CCP2 Trigger
- 20.0 Comparator Module
- Register 20-1: CMCON: Comparator Control Register
- 20.1 Comparator Configuration
- 20.2 Comparator Operation
- 20.3 Comparator Reference
- 20.4 Comparator Response Time
- 20.5 Comparator Outputs
- 20.6 Comparator Interrupts
- 20.7 Comparator Operation During Sleep
- 20.8 Effects of a Reset
- 20.9 Analog Input Connection Considerations
- 21.0 Comparator Voltage Reference Module
- 22.0 High/Low-Voltage Detect (HLVD)
- 23.0 Special Features of the CPU
- 23.1 Configuration Bits
- TABLE 23-1: Configuration Bits and Device IDs
- Register 23-1: CONFIG1h: Configuration Register 1 High (Byte Address 300001h)
- Register 23-2: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 23-3: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 23-4: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 23-5: CONFIG4L: Configuration Register 4 Low (Byte Address 300006h)
- Register 23-6: CONFIG5L: Configuration Register 5 Low (Byte Address 300008h)
- Register 23-7: CONFIG5H: Configuration Register 5 High (Byte Address 300009h)
- Register 23-8: CONFIG6L: Configuration Register 6 Low (Byte Address 30000Ah)
- Register 23-9: CONFIG6H: Configuration Register 6 High (Byte Address 30000Bh)
- Register 23-10: CONFIG7L: Configuration Register 7 Low (Byte Address 30000Ch)
- Register 23-11: CONFIG7H: Configuration Register 7 High (Byte Address 30000Dh)
- Register 23-12: DEVID1: Device ID Register 1 for PIC18F2525/2620/4525/4620
- Register 23-13: DEVID2: Device ID Register 2 for PIC18F2525/2620/4525/4620
- 23.2 Watchdog Timer (WDT)
- 23.3 Two-Speed Start-up
- 23.4 Fail-Safe Clock Monitor
- 23.5 Program Verification and Code Protection
- 23.6 ID Locations
- 23.7 In-Circuit Serial Programming
- 23.8 In-Circuit Debugger
- 23.9 Single-Supply ICSP Programming
- 23.1 Configuration Bits
- 24.0 Instruction Set Summary
- 24.1 Standard Instruction Set
- 24.2 Extended Instruction Set
- 25.0 Development Support
- 25.1 MPLAB Integrated Development Environment Software
- 25.2 MPASM Assembler
- 25.3 MPLAB C18 and MPLAB C30 C Compilers
- 25.4 MPLINK Object Linker/ MPLIB Object Librarian
- 25.5 MPLAB ASM30 Assembler, Linker and Librarian
- 25.6 MPLAB SIM Software Simulator
- 25.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 25.8 MPLAB REAL ICE In-Circuit Emulator System
- 25.9 MPLAB ICD 2 In-Circuit Debugger
- 25.10 MPLAB PM3 Device Programmer
- 25.11 PICSTART Plus Development Programmer
- 25.12 PICkit 2 Development Programmer
- 25.13 Demonstration, Development and Evaluation Boards
- 26.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 26.1 DC Characteristics: Supply Voltage PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.3 DC Characteristics: PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.4 AC (Timing) Characteristics
- 26.4.1 Timing Parameter Symbology
- 26.4.2 Timing Conditions
- 26.4.3 Timing Diagrams and Specifications
- FIGURE 26-6: External Clock Timing (All Modes Except PLL)
- TABLE 26-6: External Clock Timing Requirements
- TABLE 26-7: PLL Clock Timing Specifications (Vdd = 4.2V to 5.5V)
- TABLE 26-8: AC Characteristics: Internal RC Accuracy PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- FIGURE 26-7: CLKO and I/O Timing
- TABLE 26-9: CLKO and I/O Timing Requirements
- FIGURE 26-8: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- FIGURE 26-9: Brown-out Reset Timing
- TABLE 26-10: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements
- FIGURE 26-10: Timer0 and Timer1 External Clock Timings
- TABLE 26-11: Timer0 and Timer1 External Clock Requirements
- FIGURE 26-11: Capture/Compare/PWM Timings (All CCP Modules)
- TABLE 26-12: Capture/Compare/PWM Requirements (All CCP Modules)
- FIGURE 26-12: Parallel Slave Port Timing (PIC18F4525/4620)
- TABLE 26-13: Parallel Slave Port Requirements (PIC18F4525/4620)
- FIGURE 26-13: Example SPI Master Mode Timing (CKE = 0)
- TABLE 26-14: Example SPI Mode Requirements (Master Mode, CKE = 0)
- FIGURE 26-14: Example SPI Master Mode Timing (CKE = 1)
- TABLE 26-15: Example SPI Mode Requirements (Master Mode, CKE = 1)
- FIGURE 26-15: Example Spi Slave Mode Timing (CKE = 0)
- TABLE 26-16: Example SPI Mode Requirements (Slave Mode Timing, CKE = 0)
- FIGURE 26-16: Example SPI Slave Mode Timing (CKE = 1)
- TABLE 26-17: Example SPI Slave Mode Requirements (CKE = 1)
- FIGURE 26-17: I2C™ Bus Start/Stop Bits Timing
- TABLE 26-18: I2C™ Bus Start/Stop Bits Requirements (Slave Mode)
- FIGURE 26-18: I2C™ Bus Data Timing
- TABLE 26-19: I2C™ Bus Data Requirements (Slave Mode)
- FIGURE 26-19: Master SSP I2C™ Bus Start/Stop Bits Timing Waveforms
- TABLE 26-20: Master SSP I2C™ Bus Start/Stop Bits Requirements
- FIGURE 26-20: Master SSP I2C™ Bus Data Timing
- TABLE 26-21: Master SSP I2C™ Bus Data Requirements
- FIGURE 26-21: EUSART Synchronous Transmission (Master/Slave) Timing
- TABLE 26-22: EUSART Synchronous Transmission Requirements
- FIGURE 26-22: EUSART Synchronous Receive (Master/Slave) Timing
- TABLE 26-23: EUSART Synchronous Receive Requirements
- TABLE 26-24: A/D Converter Characteristics: PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- FIGURE 26-23: A/D Conversion Timing
- TABLE 26-25: A/D Conversion Requirements
- 27.0 DC and AC Characteristics Graphs and Tables
- FIGURE 27-1: Sleep Mode
- FIGURE 27-2: Typical Ipd vs. Vdd Across Temperature (Sleep Mode)
- FIGURE 27-3: Maximum Ipd vs. Vdd Across Temperature (Sleep Mode)
- FIGURE 27-4: Typical T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in Low-Power Mode)
- FIGURE 27-5: Maximum T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, TIOSC in Low-Power Mode)
- FIGURE 27-6: Typical T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in High-Power Mode)
- FIGURE 27-7: Maximum T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in High-Power Mode)
- FIGURE 27-8: Typical BOR Delta Current vs. Vdd Across Temp. (BORV = 2.7V, Sleep Mode)
- FIGURE 27-9: Typical WDT Current vs. Vdd Across Temperature (WDT Delta Current in Sleep Mode)
- FIGURE 27-10: Maximum WDT Current vs. Vdd Across Temperature (WDT Delta Current in Sleep Mode)
- FIGURE 27-11: Typical Idd Across Vdd (RC_RUN Mode, 25°C)
- FIGURE 27-12: Maximum Idd Across Vdd (RC_RUN Mode, 85°C)
- FIGURE 27-13: Typical and Maximum Idd Across Vdd (RC_RUN Mode, 31 kHz)
- FIGURE 27-14: Typical Idd Across Vdd (RC_IDLE Mode, 25°C)
- FIGURE 27-15: Maximum Idd Across Vdd (RC_IDLE Mode, -40°C-85°C)
- FIGURE 27-16: Typical and Maximum Idd Across Vdd (RC_IDLE Mode, 31 kHz)
- FIGURE 27-17: Typical and Maximum SEC_RUN Current vs. Vdd Across Temperature (T1OSC in Low-Power Mode)
- FIGURE 27-18: Typical and Maximum SEC_IDLE Current vs. Vdd Across Temperature (T1OSC in Low-Power Mode)
- FIGURE 27-19: Typical Idd vs. Fosc, 500 kHz to 4 MHz (PRI_RUN Mode (EC Clock), 25°C)
- FIGURE 27-20: Maximum Idd vs. Fosc, 500 kHz to 4 MHz (PRI_RUN Mode (EC Clock), -40°C to +125°C)
- FIGURE 27-21: Typical Idd vs. Fosc, 4 MHz to 40 MHz (PRI_RUN Mode (EC Clock), 25°C)
- FIGURE 27-22: Maximum Idd vs. Fosc, 4 MHz to 40 MHz (PRI_RUN Mode (EC Clock), -40°C to +125°C)
- FIGURE 27-23: Typical Idd vs. Fosc, HS/PLL (PRI_RUN Mode, 25°C)
- FIGURE 27-24: Maximum Idd vs. Fosc, HS/PLL (PRI_RUN Mode, -40°C)
- FIGURE 27-25: Typical Idd vs. Fosc, 500 kHz to 4 MHz (PRI_IDLE Mode, 25°C)
- FIGURE 27-26: Maximum Idd vs. Fosc, 500 kHz to 4 MHz (PRI_IDLE Mode, -40°C to +125°C)
- FIGURE 27-27: Typical Idd vs. Fosc, 4 MHz to 40 MHz (PRI_IDLE Mode, 25°C)
- FIGURE 27-28: Maximum Idd vs. Fosc, 4 MHz to 40 MHz (PRI_IDLE Mode, -40°C to +125°C)
- FIGURE 27-29: Typical Idd vs. Fosc, HS/PLL (PRI_IDLE Mode, 25°C)
- FIGURE 27-30: Maximum Idd vs. Fosc, HS/PLL (PRI_IDLE Mode, -40°C)
- FIGURE 27-31: Vin (ST) vs. Vdd, 25°C (-40°C to +125°C)
- FIGURE 27-32: Vin (TTL) vs. Vdd, 25°C (-40°C to +125°C)
- FIGURE 27-33: Vol vs. Iol (Vdd = 3.0V, -40°C to +85°C)
- FIGURE 27-34: Vol vs. Iol (Vdd = 5.0V, -40°C to +125°C)
- FIGURE 27-35: Voh vs. Ioh (Vdd = 3.0V, -40°C to +85°C)
- FIGURE 27-36: Voh vs. Ioh (Vdd = 5.0V, -40°C to +125°C)
- FIGURE 27-37: INTOSC Frequency vs. Vdd, Temperature (-40°C, +25°C, +85°C, +125°C)
- FIGURE 27-38: INTRC vs. Vdd Across Temperature (-40°C to +125°C)
- FIGURE 27-39: WDT Period vs. Vdd Across Temperature (1:1 Postscaler, -40°C to +125°C)
- 28.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Device Differences
- Appendix C: Conversion Considerations
- Appendix D: Migration from Baseline to Enhanced Devices
- Appendix E: Migration from Mid-Range TO Enhanced Devices
- Appendix F: Migration from High-End to Enhanced Devices
- INDEX
- Worldwide Sales and Service

PIC18F2525/2620/4525/4620
DS39626E-page 26 © 2008 Microchip Technology Inc.
2.6 Internal Oscillator Block
The PIC18F2525/2620/4525/4620 devices include an
internal oscillator block which generates two different
clock signals; either can be used as the microcontroller’s
clock source. This may eliminate the need for external
oscillator circuits on the OSC1 and/or OSC2 pins.
The main output (INTOSC) is an 8 MHz clock source,
which can be used to directly drive the device clock. It
also drives a postscaler, which can provide a range of
clock frequencies from 31 kHz to 4 MHz. The INTOSC
output is enabled when a clock frequency from 125 kHz
to 8 MHz is selected.
The other clock source is the Internal RC oscillator
(INTRC), which provides a nominal 31 kHz output.
INTRC is enabled if it is selected as the device clock
source; it is also enabled automatically when any of the
following are enabled:
• Power-up Timer
• Fail-Safe Clock Monitor
• Watchdog Timer
• Two-Speed Start-up
These features are discussed in greater detail in
Section 23.0 “Special Features of the CPU”.
The clock source frequency (INTOSC direct, INTRC
direct or INTOSC postscaler) is selected by configuring
the IRCF bits of the OSCCON register (page 30).
2.6.1 INTIO MODES
Using the internal oscillator as the clock source
eliminates the need for up to two external oscillator
pins, which can then be used for digital I/O. Two distinct
configurations are available:
• In INTIO1 mode, the OSC2 pin outputs F
OSC/4,
while OSC1 functions as RA7 for digital input and
output.
• In INTIO2 mode, OSC1 functions as RA7 and
OSC2 functions as RA6, both for digital input and
output.
2.6.2 INTOSC OUTPUT FREQUENCY
The internal oscillator block is calibrated at the factory
to produce an INTOSC output frequency of 8.0 MHz.
The INTRC oscillator operates independently of the
INTOSC source. Any changes in INTOSC across
voltage and temperature are not necessarily reflected
by changes in INTRC and vice versa.
2.6.3 OSCTUNE REGISTER
The internal oscillator’s output has been calibrated at
the factory but can be adjusted in the user’s applica-
tion. This is done by writing to the OSCTUNE register
(Register 2-1). The tuning sensitivity is constant
throughout the tuning range.
When the OSCTUNE register is modified, the INTOSC
frequency will begin shifting to the new frequency. The
INTRC clock will reach the new frequency within
8 clock cycles (approximately 8 * 32 μs=256μs). The
INTOSC clock will stabilize within 1 ms. Code execu-
tion continues during this shift. There is no indication
that the shift has occurred.
The OSCTUNE register also implements the INTSRC
and PLLEN bits, which control certain features of the
internal oscillator block. The INTSRC bit allows users
to select which internal oscillator provides the clock
source when the 31 kHz frequency option is selected.
This is covered in greater detail in Section 2.7.1
“Oscillator Control Register”.
The PLLEN bit controls the operation of the frequency
multiplier, PLL, in internal oscillator modes.
2.6.4 PLL IN INTOSC MODES
The 4x frequency multiplier can be used with the
internal oscillator block to produce faster device clock
speeds than are normally possible with an internal
oscillator. When enabled, the PLL produces a clock
speed of up to 32 MHz.
Unlike HSPLL mode, the PLL is controlled through
software. The control bit, PLLEN (OSCTUNE<6>), is
used to enable or disable its operation.
The PLL is available when the device is configured to
use the internal oscillator block as its primary clock
source (FOSC3:FOSC0 = 1001 or 1000). Additionally,
the PLL will only function when the selected output fre-
quency is either 4 MHz or 8 MHz (OSCCON<6:4> = 111
or 110). If both of these conditions are not met, the PLL
is disabled.
The PLLEN control bit is only functional in those inter-
nal oscillator modes where the PLL is available. In all
other modes, it is forced to ‘0’ and is effectively
unavailable.
2.6.5 INTOSC FREQUENCY DRIFT
The factory calibrates the internal oscillator block
output (INTOSC) for 8 MHz. However, this frequency
may drift as V
DD or temperature changes, which can
affect the controller operation in a variety of ways. It is
possible to adjust the INTOSC frequency by modifying
the value in the OSCTUNE register. This has no effect
on the INTRC clock source frequency.
Tuning the INTOSC source requires knowing when to
make the adjustment, in which direction it should be
made, and in some cases, how large a change is
needed. Three compensation techniques are
discussed in Section 2.6.5.1 “Compensating with
the EUSART”, Section 2.6.5.2 “Compensating with
the Timers” and Section 2.6.5.3 “Compensating
with the CCP Module in Capture Mode”, but other
techniques may be used.