Datasheet
Table Of Contents
- Power Management Features:
- Flexible Oscillator Structure:
- Peripheral Highlights:
- Peripheral Highlights (Continued):
- Special Microcontroller Features:
- Pin Diagrams
- Pin Diagrams (Cont.’d)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Oscillator Configurations
- 3.0 Power-Managed Modes
- 4.0 Reset
- 4.1 RCON Register
- 4.2 Master Clear (MCLR)
- 4.3 Power-on Reset (POR)
- 4.4 Brown-out Reset (BOR)
- 4.5 Device Reset Timers
- 4.5.1 Power-up Timer (PWRT)
- 4.5.2 Oscillator Start-up Timer (OST)
- 4.5.3 PLL Lock Time-out
- 4.5.4 Time-out Sequence
- TABLE 4-2: Time-out in Various Situations
- FIGURE 4-3: Time-out Sequence on Power-up (MCLR Tied to Vdd, Vdd Rise < Tpwrt)
- FIGURE 4-4: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 1
- FIGURE 4-5: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 2
- FIGURE 4-6: Slow Rise Time (MCLR Tied to Vdd, Vdd Rise > Tpwrt)
- FIGURE 4-7: Time-out Sequence on POR w/PLL Enabled (MCLR Tied to Vdd)
- 4.6 Reset State of Registers
- 5.0 Memory Organization
- 5.1 Program Memory Organization
- 5.2 PIC18 Instruction Cycle
- 5.3 Data Memory Organization
- 5.4 Data Addressing Modes
- 5.5 Data Memory and the Extended Instruction Set
- 5.6 PIC18 Instruction Execution and the Extended Instruction Set
- 6.0 Data EEPROM Memory
- 7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
- 7.4 Erasing Flash Program Memory
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
- 8.0 8 X 8 Hardware Multiplier
- 8.1 Introduction
- 8.2 Operation
- EXAMPLE 8-1: 8 x 8 Unsigned Multiply Routine
- EXAMPLE 8-2: 8 x 8 Signed Multiply Routine
- TABLE 8-1: Performance Comparison for Various Multiply Operations
- EQUATION 8-1: 16 x 16 Unsigned Multiplication Algorithm
- EXAMPLE 8-3: 16 x 16 Unsigned Multiply Routine
- EQUATION 8-2: 16 x 16 Signed Multiplication Algorithm
- EXAMPLE 8-4: 16 x 16 Signed Multiply Routine
- 9.0 I/O Ports
- 10.0 Interrupts
- 11.0 Timer0 Module
- 12.0 Timer1 Module
- 13.0 Timer2 Module
- 14.0 Timer3 Module
- 15.0 Capture/Compare/PWM (CCP) Modules
- Register 15-1: CCPxCON: CCPx Control Register (28-Pin Devices)
- 15.1 CCP Module Configuration
- 15.2 Capture Mode
- 15.3 Compare Mode
- 15.4 PWM Mode
- 16.0 Enhanced Capture/ Compare/PWM (ECCP) Module
- Register 16-1: CCP1CON: ECCP Control Register (40/44-Pin Devices)
- 16.1 ECCP Outputs and Configuration
- 16.2 Capture and Compare Modes
- 16.3 Standard PWM Mode
- 16.4 Enhanced PWM Mode
- 16.4.1 PWM Period
- 16.4.2 PWM Duty Cycle
- 16.4.3 PWM Output Configurations
- 16.4.4 Half-Bridge Mode
- 16.4.5 Full-Bridge Mode
- 16.4.6 Programmable Dead-Band Delay
- 16.4.7 Enhanced PWM Auto-Shutdown
- 16.4.8 Start-up Considerations
- 16.4.9 Setup for PWM Operation
- 16.4.10 Operation in Power-Managed Modes
- 16.4.11 Effects of a Reset
- 17.0 Master Synchronous Serial Port (MSSP) Module
- 17.1 Master SSP (MSSP) Module Overview
- 17.2 Control Registers
- 17.3 SPI Mode
- 17.4 I2C Mode
- FIGURE 17-7: MSSP Block Diagram (I2C™ Mode)
- 17.4.1 Registers
- 17.4.2 Operation
- 17.4.3 Slave Mode
- 17.4.4 Clock Stretching
- 17.4.5 General Call Address Support
- 17.4.6 Master Mode
- 17.4.7 Baud Rate
- 17.4.8 I2C Master Mode Start Condition Timing
- 17.4.9 I2C Master Mode Repeated Start Condition Timing
- 17.4.10 I2C Master Mode Transmission
- 17.4.11 I2C Master Mode Reception
- 17.4.12 Acknowledge Sequence Timing
- 17.4.13 Stop Condition Timing
- 17.4.14 Sleep Operation
- 17.4.15 Effects of a Reset
- 17.4.16 Multi-Master Mode
- 17.4.17 Multi -Master Communication, Bus Collision and Bus Arbitration
- FIGURE 17-25: Bus Collision Timing for Transmit and Acknowledge
- FIGURE 17-26: Bus Collision During Start Condition (SDA Only)
- FIGURE 17-27: Bus Collision During Start Condition (SCL = 0)
- FIGURE 17-28: BRG Reset Due to SDA Arbitration During Start Condition
- FIGURE 17-29: Bus Collision During a Repeated Start Condition (Case 1)
- FIGURE 17-30: Bus Collision During Repeated Start Condition (Case 2)
- FIGURE 17-31: Bus Collision During a Stop Condition (Case 1)
- FIGURE 17-32: Bus Collision During a Stop Condition (Case 2)
- 18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)
- Register 18-1: TXSTA: Transmit Status And Control Register
- Register 18-2: RCSTA: Receive Status And Control Register
- Register 18-3: BAUDCON: Baud Rate Control Register
- 18.1 Baud Rate Generator (BRG)
- 18.2 EUSART Asynchronous Mode
- 18.3 EUSART Synchronous Master Mode
- 18.4 EUSART Synchronous Slave Mode
- 19.0 10-Bit Analog-to-Digital Converter (A/D) Module
- Register 19-1: ADCON0: A/D Control Register 0
- Register 19-2: ADCON1: A/D Control Register 1
- Register 19-3: ADCON2: A/D Control Register 2
- FIGURE 19-1: A/D Block Diagram
- FIGURE 19-2: A/D Transfer Function
- FIGURE 19-3: Analog Input Model
- 19.1 A/D Acquisition Requirements
- 19.2 Selecting and Configuring Acquisition Time
- 19.3 Selecting the A/D Conversion Clock
- 19.4 Operation in Power-Managed Modes
- 19.5 Configuring Analog Port Pins
- 19.6 A/D Conversions
- 19.7 Discharge
- 19.8 Use of the CCP2 Trigger
- 20.0 Comparator Module
- Register 20-1: CMCON: Comparator Control Register
- 20.1 Comparator Configuration
- 20.2 Comparator Operation
- 20.3 Comparator Reference
- 20.4 Comparator Response Time
- 20.5 Comparator Outputs
- 20.6 Comparator Interrupts
- 20.7 Comparator Operation During Sleep
- 20.8 Effects of a Reset
- 20.9 Analog Input Connection Considerations
- 21.0 Comparator Voltage Reference Module
- 22.0 High/Low-Voltage Detect (HLVD)
- 23.0 Special Features of the CPU
- 23.1 Configuration Bits
- TABLE 23-1: Configuration Bits and Device IDs
- Register 23-1: CONFIG1h: Configuration Register 1 High (Byte Address 300001h)
- Register 23-2: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 23-3: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 23-4: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 23-5: CONFIG4L: Configuration Register 4 Low (Byte Address 300006h)
- Register 23-6: CONFIG5L: Configuration Register 5 Low (Byte Address 300008h)
- Register 23-7: CONFIG5H: Configuration Register 5 High (Byte Address 300009h)
- Register 23-8: CONFIG6L: Configuration Register 6 Low (Byte Address 30000Ah)
- Register 23-9: CONFIG6H: Configuration Register 6 High (Byte Address 30000Bh)
- Register 23-10: CONFIG7L: Configuration Register 7 Low (Byte Address 30000Ch)
- Register 23-11: CONFIG7H: Configuration Register 7 High (Byte Address 30000Dh)
- Register 23-12: DEVID1: Device ID Register 1 for PIC18F2525/2620/4525/4620
- Register 23-13: DEVID2: Device ID Register 2 for PIC18F2525/2620/4525/4620
- 23.2 Watchdog Timer (WDT)
- 23.3 Two-Speed Start-up
- 23.4 Fail-Safe Clock Monitor
- 23.5 Program Verification and Code Protection
- 23.6 ID Locations
- 23.7 In-Circuit Serial Programming
- 23.8 In-Circuit Debugger
- 23.9 Single-Supply ICSP Programming
- 23.1 Configuration Bits
- 24.0 Instruction Set Summary
- 24.1 Standard Instruction Set
- 24.2 Extended Instruction Set
- 25.0 Development Support
- 25.1 MPLAB Integrated Development Environment Software
- 25.2 MPASM Assembler
- 25.3 MPLAB C18 and MPLAB C30 C Compilers
- 25.4 MPLINK Object Linker/ MPLIB Object Librarian
- 25.5 MPLAB ASM30 Assembler, Linker and Librarian
- 25.6 MPLAB SIM Software Simulator
- 25.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 25.8 MPLAB REAL ICE In-Circuit Emulator System
- 25.9 MPLAB ICD 2 In-Circuit Debugger
- 25.10 MPLAB PM3 Device Programmer
- 25.11 PICSTART Plus Development Programmer
- 25.12 PICkit 2 Development Programmer
- 25.13 Demonstration, Development and Evaluation Boards
- 26.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 26.1 DC Characteristics: Supply Voltage PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.3 DC Characteristics: PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- 26.4 AC (Timing) Characteristics
- 26.4.1 Timing Parameter Symbology
- 26.4.2 Timing Conditions
- 26.4.3 Timing Diagrams and Specifications
- FIGURE 26-6: External Clock Timing (All Modes Except PLL)
- TABLE 26-6: External Clock Timing Requirements
- TABLE 26-7: PLL Clock Timing Specifications (Vdd = 4.2V to 5.5V)
- TABLE 26-8: AC Characteristics: Internal RC Accuracy PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- FIGURE 26-7: CLKO and I/O Timing
- TABLE 26-9: CLKO and I/O Timing Requirements
- FIGURE 26-8: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- FIGURE 26-9: Brown-out Reset Timing
- TABLE 26-10: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements
- FIGURE 26-10: Timer0 and Timer1 External Clock Timings
- TABLE 26-11: Timer0 and Timer1 External Clock Requirements
- FIGURE 26-11: Capture/Compare/PWM Timings (All CCP Modules)
- TABLE 26-12: Capture/Compare/PWM Requirements (All CCP Modules)
- FIGURE 26-12: Parallel Slave Port Timing (PIC18F4525/4620)
- TABLE 26-13: Parallel Slave Port Requirements (PIC18F4525/4620)
- FIGURE 26-13: Example SPI Master Mode Timing (CKE = 0)
- TABLE 26-14: Example SPI Mode Requirements (Master Mode, CKE = 0)
- FIGURE 26-14: Example SPI Master Mode Timing (CKE = 1)
- TABLE 26-15: Example SPI Mode Requirements (Master Mode, CKE = 1)
- FIGURE 26-15: Example Spi Slave Mode Timing (CKE = 0)
- TABLE 26-16: Example SPI Mode Requirements (Slave Mode Timing, CKE = 0)
- FIGURE 26-16: Example SPI Slave Mode Timing (CKE = 1)
- TABLE 26-17: Example SPI Slave Mode Requirements (CKE = 1)
- FIGURE 26-17: I2C™ Bus Start/Stop Bits Timing
- TABLE 26-18: I2C™ Bus Start/Stop Bits Requirements (Slave Mode)
- FIGURE 26-18: I2C™ Bus Data Timing
- TABLE 26-19: I2C™ Bus Data Requirements (Slave Mode)
- FIGURE 26-19: Master SSP I2C™ Bus Start/Stop Bits Timing Waveforms
- TABLE 26-20: Master SSP I2C™ Bus Start/Stop Bits Requirements
- FIGURE 26-20: Master SSP I2C™ Bus Data Timing
- TABLE 26-21: Master SSP I2C™ Bus Data Requirements
- FIGURE 26-21: EUSART Synchronous Transmission (Master/Slave) Timing
- TABLE 26-22: EUSART Synchronous Transmission Requirements
- FIGURE 26-22: EUSART Synchronous Receive (Master/Slave) Timing
- TABLE 26-23: EUSART Synchronous Receive Requirements
- TABLE 26-24: A/D Converter Characteristics: PIC18F2525/2620/4525/4620 (Industrial) PIC18LF2525/2620/4525/4620 (Industrial)
- FIGURE 26-23: A/D Conversion Timing
- TABLE 26-25: A/D Conversion Requirements
- 27.0 DC and AC Characteristics Graphs and Tables
- FIGURE 27-1: Sleep Mode
- FIGURE 27-2: Typical Ipd vs. Vdd Across Temperature (Sleep Mode)
- FIGURE 27-3: Maximum Ipd vs. Vdd Across Temperature (Sleep Mode)
- FIGURE 27-4: Typical T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in Low-Power Mode)
- FIGURE 27-5: Maximum T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, TIOSC in Low-Power Mode)
- FIGURE 27-6: Typical T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in High-Power Mode)
- FIGURE 27-7: Maximum T1OSC Delta Current vs. Vdd Across Temp. (Device in Sleep, T1OSC in High-Power Mode)
- FIGURE 27-8: Typical BOR Delta Current vs. Vdd Across Temp. (BORV = 2.7V, Sleep Mode)
- FIGURE 27-9: Typical WDT Current vs. Vdd Across Temperature (WDT Delta Current in Sleep Mode)
- FIGURE 27-10: Maximum WDT Current vs. Vdd Across Temperature (WDT Delta Current in Sleep Mode)
- FIGURE 27-11: Typical Idd Across Vdd (RC_RUN Mode, 25°C)
- FIGURE 27-12: Maximum Idd Across Vdd (RC_RUN Mode, 85°C)
- FIGURE 27-13: Typical and Maximum Idd Across Vdd (RC_RUN Mode, 31 kHz)
- FIGURE 27-14: Typical Idd Across Vdd (RC_IDLE Mode, 25°C)
- FIGURE 27-15: Maximum Idd Across Vdd (RC_IDLE Mode, -40°C-85°C)
- FIGURE 27-16: Typical and Maximum Idd Across Vdd (RC_IDLE Mode, 31 kHz)
- FIGURE 27-17: Typical and Maximum SEC_RUN Current vs. Vdd Across Temperature (T1OSC in Low-Power Mode)
- FIGURE 27-18: Typical and Maximum SEC_IDLE Current vs. Vdd Across Temperature (T1OSC in Low-Power Mode)
- FIGURE 27-19: Typical Idd vs. Fosc, 500 kHz to 4 MHz (PRI_RUN Mode (EC Clock), 25°C)
- FIGURE 27-20: Maximum Idd vs. Fosc, 500 kHz to 4 MHz (PRI_RUN Mode (EC Clock), -40°C to +125°C)
- FIGURE 27-21: Typical Idd vs. Fosc, 4 MHz to 40 MHz (PRI_RUN Mode (EC Clock), 25°C)
- FIGURE 27-22: Maximum Idd vs. Fosc, 4 MHz to 40 MHz (PRI_RUN Mode (EC Clock), -40°C to +125°C)
- FIGURE 27-23: Typical Idd vs. Fosc, HS/PLL (PRI_RUN Mode, 25°C)
- FIGURE 27-24: Maximum Idd vs. Fosc, HS/PLL (PRI_RUN Mode, -40°C)
- FIGURE 27-25: Typical Idd vs. Fosc, 500 kHz to 4 MHz (PRI_IDLE Mode, 25°C)
- FIGURE 27-26: Maximum Idd vs. Fosc, 500 kHz to 4 MHz (PRI_IDLE Mode, -40°C to +125°C)
- FIGURE 27-27: Typical Idd vs. Fosc, 4 MHz to 40 MHz (PRI_IDLE Mode, 25°C)
- FIGURE 27-28: Maximum Idd vs. Fosc, 4 MHz to 40 MHz (PRI_IDLE Mode, -40°C to +125°C)
- FIGURE 27-29: Typical Idd vs. Fosc, HS/PLL (PRI_IDLE Mode, 25°C)
- FIGURE 27-30: Maximum Idd vs. Fosc, HS/PLL (PRI_IDLE Mode, -40°C)
- FIGURE 27-31: Vin (ST) vs. Vdd, 25°C (-40°C to +125°C)
- FIGURE 27-32: Vin (TTL) vs. Vdd, 25°C (-40°C to +125°C)
- FIGURE 27-33: Vol vs. Iol (Vdd = 3.0V, -40°C to +85°C)
- FIGURE 27-34: Vol vs. Iol (Vdd = 5.0V, -40°C to +125°C)
- FIGURE 27-35: Voh vs. Ioh (Vdd = 3.0V, -40°C to +85°C)
- FIGURE 27-36: Voh vs. Ioh (Vdd = 5.0V, -40°C to +125°C)
- FIGURE 27-37: INTOSC Frequency vs. Vdd, Temperature (-40°C, +25°C, +85°C, +125°C)
- FIGURE 27-38: INTRC vs. Vdd Across Temperature (-40°C to +125°C)
- FIGURE 27-39: WDT Period vs. Vdd Across Temperature (1:1 Postscaler, -40°C to +125°C)
- 28.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Device Differences
- Appendix C: Conversion Considerations
- Appendix D: Migration from Baseline to Enhanced Devices
- Appendix E: Migration from Mid-Range TO Enhanced Devices
- Appendix F: Migration from High-End to Enhanced Devices
- INDEX
- Worldwide Sales and Service

© 2008 Microchip Technology Inc. DS39626E-page 191
PIC18F2525/2620/4525/4620
17.4.10 I
2
C MASTER MODE TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSPBUF register. This action will
set the Buffer Full flag bit, BF and allow the Baud Rate
Generator to begin counting and start the next
transmission. Each bit of address/data will be shifted
out onto the SDA pin after the falling edge of SCL is
asserted (see data hold time specification
parameter 106). SCL is held low for one Baud Rate
Generator rollover count (T
BRG). Data should be valid
before SCL is released high (see data setup time
specification parameter 107). When the SCL pin is
released high, it is held that way for T
BRG. The data on
the SDA pin must remain stable for that duration and
some hold time after the next falling edge of SCL. After
the eighth bit is shifted out (the falling edge of the eighth
clock), the BF flag is cleared and the master releases
SDA. This allows the slave device being addressed to
respond with an ACK
bit during the ninth bit time if an
address match occurred, or if data was received
properly. The status of ACK
is written into the ACKDT
bit on the falling edge of the ninth clock. If the master
receives an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared. If not, the bit is set. After the ninth
clock, the SSPIF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSPBUF, leaving SCL low and SDA
unchanged (Figure 17-21).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL until all
seven address bits and the R/W
bit are completed. On
the falling edge of the eighth clock, the master will
deassert the SDA pin, allowing the slave to respond
with an Acknowledge. On the falling edge of the ninth
clock, the master will sample the SDA pin to see if the
address was recognized by a slave. The status of the
ACK
bit is loaded into the ACKSTAT status bit
(SSPCON2<6>). Following the falling edge of the ninth
clock transmission of the address, the SSPIF is set, the
BF flag is cleared and the Baud Rate Generator is
turned off until another write to the SSPBUF takes
place, holding SCL low and allowing SDA to float.
17.4.10.1 BF Status Flag
In Transmit mode, the BF bit (SSPSTAT<0>) is set
when the CPU writes to SSPBUF and is cleared when
all 8 bits are shifted out.
17.4.10.2 WCOL Status Flag
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL flag is set and the contents of the
buffer are unchanged (the write doesn’t occur) after
2TCY after the SSPBUF write. If SSPBUF is rewritten
within 2 T
CY, the WCOL bit is set and SSPBUF is
updated. This may result in a corrupted transfer. The
user should verify that the WCOL flag is clear after
each write to SSPBUF to ensure the transfer is correct.
17.4.10.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit (SSPCON2<6>) is
cleared when the slave has sent an Acknowledge
(ACK
= 0) and is set when the slave does not Acknowl-
edge (ACK
= 1). A slave sends an Acknowledge when
it has recognized its address (including a general call),
or when the slave has properly received its data.
17.4.11 I
2
C MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable bit, RCEN (SSPCON2<3>).
The Baud Rate Generator begins counting and on each
rollover, the state of the SCL pin changes (high-to-low/
low-to-high) and data is shifted into the SSPSR. After
the falling edge of the eighth clock, the receive enable
flag is automatically cleared, the contents of the
SSPSR are loaded into the SSPBUF, the BF flag bit is
set, the SSPIF flag bit is set and the Baud Rate Gener-
ator is suspended from counting, holding SCL low. The
MSSP is now in Idle state awaiting the next command.
When the buffer is read by the CPU, the BF flag bit is
automatically cleared. The user can then send an
Acknowledge bit at the end of reception by setting the
Acknowledge Sequence Enable bit, ACKEN
(SSPCON2<4>).
17.4.11.1 BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
17.4.11.2 SSPOV Status Flag
In receive operation, the SSPOV bit is set when 8 bits
are received into the SSPSR and the BF flag bit is
already set from a previous reception.
17.4.11.3 WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write doesn’t occur).
Note: The MSSP module must be in an Idle state
before the RCEN bit is set or the RCEN bit
will be disregarded.