Datasheet

Table Of Contents
© 2008 Microchip Technology Inc. DS39626E-page 331
PIC18F2525/2620/4525/4620
Supply Current (IDD)
(2)
PIC18LFX525/X620 65 100 μA-40°C
VDD = 2.0V
F
OSC = 1 MHz
(PRI_IDLE mode,
EC oscillator)
65 100 μA+25°C
70 110 μA+85°C
PIC18LFX525/X620 120 140 μA-40°C
V
DD = 3.0V120 140 μA+25°C
130 160 μA+85°C
All devices 230 300 μA-40°C
V
DD = 5.0V
235 300 μA+25°C
240 300 μA+85°C
Extended devices only 260 500 μA +125°C
PIC18LFX525/X620 260 360 μA-40°C
V
DD = 2.0V
F
OSC = 4 MHz
(PRI_IDLE mode,
EC oscillator)
255 360 μA+25°C
270 360 μA+85°C
PIC18LFX525/X620 420 620 μA-40°C
V
DD = 3.0V430 620 μA+25°C
450 650 μA+85°C
All devices 0.9 1.2 mA -40°C
VDD = 5.0V
0.9 1.2 mA +25°C
0.9 1.2 mA +85°C
Extended devices only 1 1.3 mA +125°C
Extended devices only 2.8 6.0 mA +125°C V
DD = 4.2V FOSC = 25 MHz
(PRI_IDLE mode,
EC oscillator)
4.3 8.0 mA +125°C V
DD = 5.0V
All devices 6.0 10 mA -40°C
V
DD = 4.2V
F
OSC = 40 MHz
(PRI_IDLE mode,
EC oscillator)
6.2 10 mA +25°C
6.6 10 mA +85°C
All devices 8.1 13 mA -40°C
V
DD = 5.0V9.1 12 mA +25°C
8.3 12 mA +85°C
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2525/2620/4525/4620 (Industrial)
PIC18LF2525/2620/4525/4620 (Industrial) (Continued)
PIC18LF2525/2620/4525/4620
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
PIC18F2525/2620/4525/4620
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
-40°C T
A +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.