Datasheet

© 2009 Microchip Technology Inc. DS39636D-page 323
PIC18F2X1X/4X1X
Supply Current (IDD)
(2,3)
PIC18LF2X1X/4X1X 65 130 μA-40°C
V
DD = 2.0V
F
OSC = 1 MHz
(PRI_IDLE mode,
EC oscillator)
65 120 μA+25°C
70 115 μA+85°C
PIC18LF2X1X/4X1X 120 270 μA-40°C
V
DD = 3.0V120 250 μA+25°C
130 240 μA+85°C
All devices 300 480 μA-40°C
V
DD = 5.0V
240 450 μA+25°C
300 430 μA+85°C
Extended devices only 320 900 μA +125°C
PIC18LF2X1X/4X1X 260 475 μA-40°C
V
DD = 2.0V
F
OSC = 4 MHz
(PRI_IDLE mode,
EC oscillator)
255 450 μA+25°C
270 430 μA+85°C
PIC18LF2X1X/4X1X 420 900 μA-40°C
V
DD = 3.0V430 850 μA+25°C
450 810 μA+85°C
All devices 0.9 1.5 mA -40°C
VDD = 5.0V
0.9 1.4 mA +25°C
0.9 1.3 mA +85°C
Extended devices only 1 1.2 mA +125°C
Extended devices only 2.8 7.0 mA +125°C V
DD = 4.2V FOSC = 25 MHz
(PRI_IDLE mode,
EC oscillator)
4.3 11 mA +125°C V
DD = 5.0V
All devices 6.0 16 mA -40°C
V
DD = 4.2V
F
OSC = 40 MHz
(PRI_IDLE mode,
EC oscillator)
6.2 16 mA +25°C
6.6 16 mA +85°C
All devices 8.1 18 mA -40°C
V
DD = 5.0V9.1 18 mA +25°C
8.3 18 mA +85°C
25.2 DC Characteristics: Power-Down and Supply Current
PIC18F2X1X/4X1X (Industrial)
PIC18LF2X1X/4X1X (Industrial) (Continued)
PIC18LF2X1X/4X1X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
PIC18F2X1X/4X1X
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
-40°C T
A +125°C for extended
ParamNo. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD;
MCLR
= VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in kΩ.
4: Low-power Timer1 oscillator selected.
5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.