Datasheet

© 2009 Microchip Technology Inc. DS39636D-page 321
PIC18F2X1X/4X1X
Supply Current (IDD)
(2,3)
PIC18LF2X1X/4X1X 250 500 μA-40°C
V
DD = 2.0V
F
OSC = 1 MHZ
(PRI_RUN,
EC oscillator)
260 500 μA+25°C
250 500 μA+85°C
PIC18LF2X1X/4X1X 550 650 μA-40°C
V
DD = 3.0V480 650 μA+25°C
460 650 μA+85°C
All devices 1.2 1.6 mA -40°C
VDD = 5.0V
1.1 1.5 mA +25°C
1.0 1.4 mA +85°C
Extended devices only 1.0 3.5 mA +125°C
PIC18LF2X1X/4X1X 0.72 2.0 mA -40°C
V
DD = 2.0V
F
OSC = 4 MHz
(PRI_RUN,
EC oscillator)
0.74 2.0 mA +25°C
0.74 2.0 mA +85°C
PIC18LF2X1X/4X1X 1.3 3.0 mA -40°C
V
DD = 3.0V1.3 3.0 mA +25°C
1.3 3.0 mA +85°C
All devices 2.7 6.0 mA -40°C
VDD = 5.0V
2.6 6.0 mA +25°C
2.5 6.0 mA +85°C
Extended devices only 2.6 7.0 mA +125°C
Extended devices only 8.4 21 mA +125°C V
DD = 4.2V FOSC = 25 MHz
(PRI_RUN,
EC oscillator)
11 28 mA +125°C V
DD = 5.0V
All devices 15 35 mA -40°C
V
DD = 4.2V
F
OSC = 40 MHZ
(PRI_RUN,
EC oscillator)
16 35 mA +25°C
16 35 mA +85°C
All devices 21 40 mA -40°C
V
DD = 5.0V21 40 mA +25°C
21 40 mA +85°C
25.2 DC Characteristics: Power-Down and Supply Current
PIC18F2X1X/4X1X (Industrial)
PIC18LF2X1X/4X1X (Industrial) (Continued)
PIC18LF2X1X/4X1X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F2X1X/4X1X
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
ParamNo. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD;
MCLR
= VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in kΩ.
4: Low-power Timer1 oscillator selected.
5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.