Datasheet
© 2009 Microchip Technology Inc. DS39632E-page 375
PIC18F2455/2550/4455/4550
Supply Current (IDD)
(2)
PIC18LFX455/X550 14 40 μA-40°C
V
DD = 2.0V
F
OSC = 32 kHz
(3)
(SEC_RUN mode,
Timer1 as clock)
15 40 μA+25°C
16 40 μA+85°C
PIC18LFX455/X550 40 74 μA-40°C
VDD = 3.0V35 70 μA+25°C
31 67 μA+85°C
All devices 99 150 μA-40°C
V
DD = 5.0V81 150 μA+25°C
75 150 μA+85°C
PIC18LFX455/X550 2.5 12 μA-40°C
V
DD = 2.0V
F
OSC = 32 kHz
(3)
(SEC_IDLE mode,
Timer1 as clock)
3.7 12 μA+25°C
4.5 12 μA+85°C
PIC18LFX455/X550 5.0 15 μA-40°C
V
DD = 3.0V5.4 15 μA+25°C
6.3 15 μA+85°C
All devices 8.5 25 μA-40°C
V
DD = 5.0V9.0 25 μA+25°C
10.5 36 μA+85°C
28.2 DC Characteristics: Power-Down and Supply Current
PIC18F2455/2550/4455/4550 (Industrial)
PIC18LF2455/2550/4455/4550 (Industrial) (Continued)
PIC18LF2455/2550/4455/4550
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F2455/2550/4455/4550
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
Param
No.
Symbol Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended
temperature crystals are available at a much higher cost.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.