Datasheet

PIC18FXX2
DS39564C-page 310 © 2006 Microchip Technology Inc.
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
F
A
A1 A2
α
E
E1
#leads=n1
p
B
D1 D
n
1
2
φ
c
β
L
CH x 45°
1.140.890.64.045.035.025CH
Pin 1 Corner Chamfer
1.00 REF..039 REF.F
Footprint (Reference)
Units INCHES MILLIMETERS
*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
44 44
Pitch
p
.031 0.80
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle
φ
03.5 7 03.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10
Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10
Pins per Side n1 11 11
Lead Thickness
c
.004 .006 .008 0.09 0.15 0.20
Lead Width B .012 .015 .017 0.30 0.38 0.44
Mold Draft Angle Top
α
5 10 15 5 10 15
Mold Draft Angle Bottom
β
5 10 15 5 10 15
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
JEDEC Equivalent: MS-026
Revised 07-22-05
* Controlling Parameter
REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
Drawing No. C04-076