Datasheet

© 2006 Microchip Technology Inc. DS39564C-page 263
PIC18FXX2
IDD Supply Current
(2,4)
(Continued)
D010C
PIC18LFXX2
—1025mA
EC, ECIO osc configurations
VDD = 4.2V, -40°C to +85°C
D010C
PIC18FXX2
— 10 25 mA
EC, ECIO osc configurations
V
DD = 4.2V, -40°C to +125°C
D013
PIC18LFXX2
—
—
—
.6
10
15
2
15
25
mA
mA
mA
HS osc configuration
F
OSC = 4 MHz, VDD = 2.0V
F
OSC = 25 MHz, VDD = 5.5V
HS + PLL osc configurations
FOSC = 10 MHz, VDD = 5.5V
D013
PIC18FXX2
—
—
10
15
15
25
mA
mA
HS osc configuration
F
OSC = 25 MHz, VDD = 5.5V
HS + PLL osc configurations
F
OSC = 10 MHz, VDD = 5.5V
D014
PIC18LFXX2
—1555μA
Timer1 osc configuration
F
OSC = 32 kHz, VDD = 2.0V
D014
PIC18FXX2
—
—
—
—
200
250
μA
μA
Timer1 osc configuration
F
OSC = 32 kHz, VDD = 4.2V, -40°C to +85°C
F
OSC = 32 kHz, VDD = 4.2V, -40°C to +125°C
I
PD Power-down Current
(3)
D020
PIC18LFXX2
—
—
—
.08
.1
3
.9
4
10
μA
μA
μA
V
DD = 2.0V, +25°C
V
DD = 2.0V, -40°C to +85°C
V
DD = 4.2V, -40°C to +85°C
D020
D021B
PIC18FXX2 —
—
—
.1
3
15
.9
10
25
μA
μA
μA
VDD = 4.2V, +25°C
V
DD = 4.2V, -40°C to +85°C
V
DD = 4.2V, -40°C to +125°C
22.1 DC Characteristics: PIC18FXX2 (Industrial, Extended)
PIC18LFXX2 (Industrial) (Continued)
PIC18LFXX2
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18FXX2
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode, or during a device RESET, without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active Operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS, and all
features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR,...).
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in kOhm.
5: The LVD and BOR modules share a large portion of circuitry. The ΔI
BOR and ΔILVD currents are not additive.
Once one of these modules is enabled, the other may also be enabled without further penalty.