Datasheet

PIC18FXX2
DS39564C-page 262 © 2006 Microchip Technology Inc.
IDD Supply Current
(2,4)
D010
PIC18LFXX2
—
—
—
—
—
—
—
—
—
.5
.5
1.2
.3
.3
1.5
.3
.3
.75
1
1.25
2
1
1
3
1
1
3
mA
mA
mA
mA
mA
mA
mA
mA
mA
XT osc configuration
V
DD = 2.0V, +25°C, FOSC = 4 MHz
V
DD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
RC osc configuration
V
DD = 2.0V, +25°C, FOSC = 4 MHz
V
DD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
RCIO osc configuration
VDD = 2.0V, +25°C, FOSC = 4 MHz
V
DD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
D010
PIC18FXX2
—
—
—
—
—
—
—
—
—
1.2
1.2
1.2
1.5
1.5
1.6
.75
.75
.8
1.5
2
3
3
4
4
2
3
3
mA
mA
mA
mA
mA
mA
mA
mA
mA
XT osc configuration
V
DD = 4.2V, +25°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
RC osc configuration
VDD = 4.2V, +25°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
RCIO osc configuration
V
DD = 4.2V, +25°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
D010A
PIC18LFXX2
—1430μA
LP osc, F
OSC = 32 kHz, WDT disabled
V
DD = 2.0V, -40°C to +85°C
D010A
PIC18FXX2
—
—
40
50
70
100
μA
μA
LP osc, FOSC = 32 kHz, WDT disabled
V
DD = 4.2V, -40°C to +85°C
V
DD = 4.2V, -40°C to +125°C
22.1 DC Characteristics: PIC18FXX2 (Industrial, Extended)
PIC18LFXX2 (Industrial) (Continued)
PIC18LFXX2
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18FXX2
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Symbol Characteristic Min Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode, or during a device RESET, without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature, also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active Operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD or VSS, and all
features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR,...).
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in kOhm.
5: The LVD and BOR modules share a large portion of circuitry. The ΔI
BOR and ΔILVD currents are not additive.
Once one of these modules is enabled, the other may also be enabled without further penalty.