Datasheet

PIC18F2450/4450
© 2008 Microchip Technology Inc. DS39760D-page 275
D022
(ΔI
WDT)
Module Differential Currents (ΔI
WDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD)
Watchdog Timer 1.3 3.8 μA-40°C
V
DD = 2.0V1.5 3.8 μA+25°C
2.3 3.8 μA+85°C
1.8 4.6 μA-40°C
V
DD = 3.0V2.0 4.6 μA+25°C
3.0 4.6 μA+85°C
3.3 10 μA-40°C
V
DD = 5.0V3.6 10 μA+25°C
3.9 10 μA+85°C
D022A
(ΔI
BOR)
Brown-out Reset
(4)
40 52 μA -40°C to +85°C VDD = 3.0V
45 63 μA -40°C to +85°C
V
DD = 5.0V
02μA -40°C to +85°C
Sleep mode,
BOREN1:BOREN0 = 10
D022B
(ΔI
LVD)
High/Low-Voltage
Detect
(4)
22 47 μA -40°C to +85°C VDD = 2.0V
25 58 μA -40°C to +85°C V
DD = 3.0V
29 69 μA -40°C to +85°C V
DD = 5.0V
D025
(ΔI
OSCB)
Timer1 Oscillator 1.5 4.5 μA-40°C
V
DD = 2.0V 32 kHz on Timer1
(3)
1.2 4.5 μA+25°C
1.6 4.5 μA+85°C
1.7 6.0 μA-40°C
V
DD = 3.0V 32 kHz on Timer1
(3)
1.8 6.0 μA+25°C
2.0 6.0 μA+85°C
1.4 8.0 μA-40°C
V
DD = 5.0V 32 kHz on Timer1
(3)
1.5 8.0 μA+25°C
1.9 8.0 μA+85°C
D026
(ΔI
AD)
A/D Converter 0.2 2.0 μA -40°C to +85°C V
DD = 2.0V
A/D on, not converting0.2 2.0 μA -40°C to +85°C V
DD = 3.0V
0.2 2.0 μA -40°C to +85°C V
DD = 5.0V
21.2 DC Characteristics: Power-Down and Supply Current
PIC18F2450/4450 (Industrial)
PIC18LF2450/4450 (Industrial) (Continued)
PIC18LF2450/4450
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F2450/4450
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended
temperature crystals are available at a much higher cost.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.