Datasheet
PIC18F2450/4450
© 2008 Microchip Technology Inc. DS39760D-page 271
Supply Current (IDD)
(2)
PIC18LF2450/4450 10 32 μA-40°C
V
DD = 2.0V
F
OSC = 31 kHz
(RC_RUN mode,
INTRC source)
10 30 μA+25°C
12 29 μA+85°C
PIC18LF2450/4450 35 63 μA-40°C
V
DD = 3.0V30 60 μA+25°C
25 57 μA+85°C
All devices 95 168 μA-40°C
V
DD = 5.0V75 160 μA+25°C
65 152 μA+85°C
PIC18LF2450/4450 2.3 8 μA-40°C
V
DD = 2.0V
F
OSC = 31 kHz
(RC_IDLE mode,
INTRC source)
2.5 8 μA+25°C
3.3 11 μA+85°C
PIC18LF2450/4450 3.3 11 μA-40°C
VDD = 3.0V3.6 11 μA+25°C
4.0 15 μA+85°C
All devices 6.5 16 μA-40°C
V
DD = 5.0V7.0 16 μA+25°C
9.0 36 μA+85°C
21.2 DC Characteristics: Power-Down and Supply Current
PIC18F2450/4450 (Industrial)
PIC18LF2450/4450 (Industrial) (Continued)
PIC18LF2450/4450
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F2450/4450
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR = VDD; WDT enabled/disabled as specified.
3: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended
temperature crystals are available at a much higher cost.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.