Datasheet

PIC18F2682/2685/4682/4685
DS39761C-page 6 © 2009 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Oscillator Configurations ............................................................................................................................................................ 25
3.0 Power-Managed Modes ............................................................................................................................................................. 35
4.0 Reset .......................................................................................................................................................................................... 43
5.0 Memory Organization ................................................................................................................................................................. 63
6.0 Flash Program Memory.............................................................................................................................................................. 97
7.0 Data EEPROM Memory ........................................................................................................................................................... 107
8.0 8 x 8 Hardware Multiplier.......................................................................................................................................................... 113
9.0 Interrupts .................................................................................................................................................................................. 115
10.0 I/O Ports ................................................................................................................................................................................... 131
11.0 Timer0 Module ......................................................................................................................................................................... 149
12.0 Timer1 Module ......................................................................................................................................................................... 153
13.0 Timer2 Module ......................................................................................................................................................................... 159
14.0 Timer3 Module ......................................................................................................................................................................... 161
15.0 Capture/Compare/PWM (CCP1) Modules ............................................................................................................................... 165
16.0 Enhanced Capture/Compare/PWM (ECCP1) Module.............................................................................................................. 175
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 189
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 229
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 249
20.0 Comparator Module.................................................................................................................................................................. 259
21.0 Comparator Voltage Reference Module................................................................................................................................... 265
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 269
23.0 ECAN™ Technology ................................................................................................................................................................ 275
24.0 Special Features of the CPU.................................................................................................................................................... 345
25.0 Instruction Set Summary .......................................................................................................................................................... 365
26.0 Development Support............................................................................................................................................................... 415
27.0 Electrical Characteristics .......................................................................................................................................................... 419
28.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 455
29.0 Packaging Information.............................................................................................................................................................. 457
Appendix A: Revision History............................................................................................................................................................. 465
Appendix B: Device Differences......................................................................................................................................................... 465
Appendix C: Conversion Considerations ........................................................................................................................................... 466
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 466
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 467
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 467
The Microchip Web Site..................................................................................................................................................................... 481
Customer Change Notification Service .............................................................................................................................................. 481
Customer Support .............................................................................................................................................................................. 481
Reader Response .............................................................................................................................................................................. 482
PIC18F2682/2685/4682/4685 Product Identification System ............................................................................................................ 483