Datasheet

© 2009 Microchip Technology Inc. DS39761C-page 463
PIC18F2682/2685/4682/4685
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 44
Pitch e 0.65 BSC
Overall Height A 0.80 0.90 1.00
Standoff A1 0.00 0.02 0.05
Contact Thickness A3 0.20 REF
Overall Width E 8.00 BSC
Exposed Pad Width E2 6.30 6.45 6.80
Overall Length D 8.00 BSC
Exposed Pad Length D2 6.30 6.45 6.80
Contact Width b 0.25 0.30 0.38
Contact Length L 0.30 0.40 0.50
Contact-to-Exposed Pad K 0.20 – –
D
EXPOSED
PAD
D2
e
b
K
L
E2
2
1
N
NOTE 1
2
1
E
N
BOTTOM VIEW
TOP VIEW
A3
A1
A
Microchip Technology Drawing C04-103B