Datasheet

© 2008 Microchip Technology Inc. DS39626E-page 329
PIC18F2525/2620/4525/4620
Supply Current (IDD)
(2)
PIC18LFX525/X620 250 350 μA-40°C
V
DD = 2.0V
F
OSC = 1 MHZ
(PRI_RUN,
EC oscillator)
260 350 μA+25°C
250 350 μA+85°C
PIC18LFX525/X620 550 650 μA-40°C
V
DD = 3.0V480 640 μA+25°C
460 600 μA+85°C
All devices 1.2 1.5 mA -40°C
V
DD = 5.0V
1.1 1.4 mA +25°C
1.0 1.3 mA +85°C
Extended devices only 1.0 3.0 mA +125°C
PIC18LFX525/X620 0.72 1.0 mA -40°C
V
DD = 2.0V
F
OSC = 4 MHz
(PRI_RUN,
EC oscillator)
0.74 1.0 mA +25°C
0.74 1.0 mA +85°C
PIC18LFX525/X620 1.3 1.8 mA -40°C
VDD = 3.0V1.3 1.8 mA +25°C
1.3 1.8 mA +85°C
All devices 2.7 4.0 mA -40°C
V
DD = 5.0V
2.6 4.0 mA +25°C
2.5 4.0 mA +85°C
Extended devices only 2.6 5.0 mA +125°C
Extended devices only 8.4 13 mA +125°C V
DD = 4.2V FOSC = 25 MHz
(PRI_RUN,
EC oscillator)
11 16 mA +125°C
VDD = 5.0V
All devices 15 20 mA -40°C
V
DD = 4.2V
F
OSC = 40 MHZ
(PRI_RUN,
EC oscillator)
15 20 mA +25°C
15 20 mA +85°C
All devices 20 25 mA -40°C
V
DD = 5.0V20 25 mA +25°C
20 25 mA +85°C
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2525/2620/4525/4620 (Industrial)
PIC18LF2525/2620/4525/4620 (Industrial) (Continued)
PIC18LF2525/2620/4525/4620
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F2525/2620/4525/4620
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.
When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.