Datasheet

PIC18(L)F2X/45K50
DS30684A-page 462  2012 Microchip Technology Inc.
29.2 DC Characteristics: Power-Down Current, PIC18(L)F2X/45K50
PIC18LF2X/45K50
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +85°C
PIC18F2X/45K50
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +85°C
Param
No.
Device Characteristics
Typ
+25°C
Typ
+60°C
Max
+85°C
Units
Conditions
V
DD Notes
Power-down Base Current (IPD)
(1)
D006 Sleep mode
0.01 0.04 2 A1.8V
WDT, BOR, FVR and SOSC
disabled, all Peripherals
inactive
0.01 0.06 2 A3.0V
12 13 25 A 2.3V
13 14 30 A 3.0V
13 14 35 A 5.0V
Power-down Module Differential Current (delta IPD)
D007 Watchdog Timer
0.3 0.3 2.5 A1.8V
0.5 0.5 2.5 A3.0V
0.35 0.35 5.0 A 2.3V
0.5 0.5 5.0 A 3.0V
0.5 0.5 5.0 A 5.0V
D008 Brown-out Reset
(2)
88.515A2.0V
99.515A3.0V
3.4 3.4 15 A 2.3V
3.8 3.8 15 A 3.0V
5.2 5.2 15 A 5.0V
D010 High/Low Voltage Detect
(2)
6.5 6.7 15 A2.0V
77.515A3.0V
2.1 2.1 15 A 2.3V
2.4 2.4 15 A 3.0V
3.2 3.2 15 A 5.0V
D011 Secondary Oscillator
0.5 1 3 A1.8V
32 kHz on SOSC
0.6 1.1 4 A3.0V
0.5 1 3 A 2.3V
0.6 1.1 4 A 3.0V
0.6 1.1 5 A 5.0V
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: On LF devices, the BOR, HLVD and FVR enable internal band gap reference. With more than one of these
modules enabled, the current consumption will be less than the sum of the specifications. On F devices,
the internal band gap reference is always enabled and its current consumption is included in the Power-
down Base Current (I
PD).
3: A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.