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PIC18F2585/2680/4585/4680

In the PIC18F2585/2680/4585/4680 Device Data

Sheet (DS39625C), the following clarifications and cor-

rections should be noted. Any silicon issues related to

these devices will be reported in a separate silicon

errata. Please check the Microchip web site for any

existing issues.

1. Module: Electrical Characteristics

(Power-Down and Supply

Current)

The eight-page table in Section 27.2 “DC Char-

acteristics: Power-Down and Supply Current”

is updated, on three pages, with the corrections

noted in bold text.

On page 419, the second page of the table, the Units

column is changed for the top row entry:

27.2 DC Characteristics: Power-Down and Supply Current

PIC18F2585/2680/4585/4680 (Industrial)

PIC18LF2585/2680/4585/4680 (Industrial) (Continued)

PIC18LF2585/2680/4585/4680

(Industrial)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ T

A ≤ +85°C for industrial

PIC18F2585/2680/4585/4680

(Industrial, Extended)

Standard Operating Conditions (unless otherwise stated)

Operating temperature -40°C ≤ T

A ≤ +85°C for industrial

-40°C ≤ T

A ≤ +125°C for extended

Param

No.

Device Typ Max Units Conditions

PIC18LFX585/X680 0.53 1.10 mA -40°C

DD = 2.0V

OSC = 1 MHz

(RC_RUN mode,

Internal oscillator source)

0.55 1.10 mA +25°C

0.56 1.10 mA +85°C

PIC18LFX585/X680 0.94 1.20 mA -40°C

DD = 3.0V0.90 1.20 mA +25°C

0.88 1.20 mA +85°C

All devices 1.80 2.30 mA -40°C

DD = 5.0V

1.70 2.30 mA +25°C

1.60 2.30 mA +85°C

PIC18FX585/X680 2.60 3.60 mA +125°C

Legend: Shading of rows is to assist in readability of the table.

Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the

part in Sleep mode, with all I/O pins in high-impedance state and tied to V

DD or VSS and all features that add delta current

disabled (such as WDT, Timer1 Oscillator, BOR, etc.).

2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading

and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on

the current consumption. The test conditions for all I

DD measurements in active operation mode are:

OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V

DD;

MCLR

= VDD; WDT enabled/disabled as specified.

3: For RC oscillator configurations, current through R

EXT is not included. The current through the resistor can be estimated

by the formula Ir = V

DD/2REXT (mA) with REXT in kΩ.

4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature

crystals are available at a much higher cost.

PIC18F2585/2680/4585/4680 Data Sheet Errata

Summary of content (8 pages)

PAGE 1
PIC18F2585/2680/4585/4680 PIC18F2585/2680/4585/4680 Data Sheet Errata In the PIC18F2585/2680/4585/4680 Device Data Sheet (DS39625C), the following clarifications and corrections should be noted. Any silicon issues related to these devices will be reported in a separate silicon errata. Please check the Microchip web site for any existing issues. 1. Module: Electrical Characteristics (Power-Down and Supply Current) The eight-page table in Section 27.
PAGE 2
PIC18F2585/2680/4585/4680 On page 423, the sixth page of the table, the Units column is changed for the top three row entries: 27.
PAGE 3
PIC18F2585/2680/4585/4680 On page 425, the last page of the eight-page table, the temperature is changed for the bottom row and the punctuation fixed for the Conditions text: 27.
PAGE 4
PIC18F2585/2680/4585/4680 2. Module: ECAN™ Technology The first paragraph of Section 23.6.1 “Initiating Transmission” is modified as shown. 23.6.1 INITIATING TRANSMISSION For the MCU to have write access to the message buffer, the TXREQ bit must be clear, indicating that the message buffer is clear of any pending message to be transmitted. Note: The time between the clearing of the TXREQ bit and when the TX buffer has write access can be as long as four instruction cycles.
PAGE 5
PIC18F2585/2680/4585/4680 4. Module: Master Synchronous Serial Port (MSSP) – Serial Peripheral Interface (SPI) The following note has been added to the end of Section 17.3.3 “Enabling SPI I/O”. Note: When the module is enabled and in Master mode (CKE, SSPSTAT<6> = 1), a small glitch of approximately half a TCY may be seen on the SCK pin. To resolve this, keep the SCK pin as an input while setting SPEN. Then, configure the SCK pin as an output (TRISC<3> = 0). © 2007 Microchip Technology Inc. 5.
PAGE 6
PIC18F2585/2680/4585/4680 REVISION HISTORY Rev A Document (05/2006) First revision of this document, split from DS80202 (previous “PIC18F2585/2680/4585/4680 Rev. A1 Silicon/Data Sheet Errata”). Includes previous data sheet clarification issues 1 (DC Characteristics) and 2 (MOVFF Instruction), reordered as issues 1 (Instruction Set) and 2 (DC Characteristics).
PAGE 7
Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature.
PAGE 8
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