Datasheet

© 2006 Microchip Technology Inc. DS41159E-page 333
PIC18FXX8
IDD Supply Current
(2,3,4)
D010 PIC18LFXX8
—
—
—
—
—
—
—
—
—
.7
.7
1.7
1
1
2.5
.7
.7
1.8
2
2
4
2.5
2.5
5
2.5
2.5
4
mA
mA
mA
mA
mA
mA
mA
mA
mA
XT oscillator configuration
V
DD = 2.0V, +25°C, FOSC = 4 MHz
V
DD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
RC oscillator configuration
V
DD = 2.0V, +25°C, FOSC = 4 MHz
V
DD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
RCIO oscillator configuration
VDD = 2.0V, +25°C, FOSC = 4 MHz
V
DD = 2.0V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
D010 PIC18FXX8
—
—
—
—
—
—
—
—
—
1.7
1.7
1.7
2.5
2.5
2.5
1.8
1.8
1.8
4
4
4
5
5
6
4
5
5
mA
mA
mA
mA
mA
mA
mA
mA
mA
XT oscillator configuration
V
DD = 4.2V, +25°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
RC oscillator configuration
V
DD = 4.2V, +25°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
RCIO oscillator configuration
VDD = 4.2V, +25°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +85°C, FOSC = 4 MHz
V
DD = 4.2V, -40°C to +125°C, FOSC = 4 MHz
D010A PIC18LFXX8
—1840μA
LP oscillator, F
OSC = 32 kHz, WDT disabled
V
DD = 2.0V, -40°C to +85°C
D010A PIC18FXX8
—
—
60
60
150
180
μA
μA
LP oscillator, FOSC = 32 kHz, WDT disabled
V
DD = 4.2V, -40°C to +85°C
V
DD = 4.2V, -40°C to +125°C
27.1 DC Characteristics (Continued)
PIC18LFXX8
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18FXX8
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Symbol
Characteristic/
Device
Min Typ Max Units Conditions
Legend: Rows are shaded for improved readability.
Note 1: This is the limit to which V
DD can be lowered in Sleep mode, or during a device Reset, without losing RAM
data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD and VSS
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, ...).
4: For RC oscillator configuration, current through R
EXT is not included. The current through the resistor can
be estimated by the formula Ir = V
DD/2 REXT (mA) with REXT in kOhm.
5: The LVD and BOR modules share a large portion of circuitry. The ΔI
BOR and ΔILVD currents are not
additive. Once one of these modules is enabled, the other may also be enabled without further penalty.