Datasheet

PIC18F2420/2520/4420/4520
DS39631B-page 334 Preliminary © 2007 Microchip Technology Inc.
Module Differential Currents (ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD)
D022
(ΔI
WDT)
Watchdog Timer 1.3 7.6 μA-40°C
V
DD = 2.0V1.4 8.0 μA+25°C
2.0 8.4 μA+85°C
1.9 11.4 μA-40°C
V
DD = 3.0V2.0 12.0 μA+25°C
2.8 12.6 μA+85°C
4.0 14.3 μA-40°C
V
DD = 5.0V5.5 15.0 μA+25°C
5.6 15.8 μA+85°C
D022A
(ΔI
BOR)
Brown-out Reset
(5)
35 52 μA-40°C to +85°CVDD = 3.0V
40 63 μA-40°C to +85°CV
DD = 5.0V
40 63 μA-40°C to +85°CV
DD = 5.0V
Sleep mode,
BOREN1:BOREN0 = 10
D022B
(ΔI
LVD)
High/Low-Voltage
Detect
(5)
22 47 μA-40°C to +85°C
V
DD = 2.0V
25 58 μA-40°C to +85°CV
DD = 3.0V
29 69 μA-40°C to +85°CV
DD = 5.0V
D025
(ΔI
OSCB)
Timer1 Oscillator 0.01 4.8 μA-10°C
V
DD = 2.0V 32 kHz on Timer1
(4)
0.01 5.0 μA+25°C
0.01 5.3 μA+70°C
0.01 7.6 μA-10°C
V
DD = 3.0V 32 kHz on Timer1
(4)
0.01 8.0 μA+25°C
0.01 8.4 μA+70°C
0.01 9.5 μA-10°C
V
DD = 5.0V 32 kHz on Timer1
(4)
0.01 10.0 μA+25°C
0.01 10.5 μA+70°C
D026
(ΔI
AD)
A/D Converter 1.0 2.0 μAV
DD = 2.0V
A/D on, not converting1.0 2.0 μAVDD = 3.0V
1.0 2.0 μAV
DD = 5.0V
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2420/2520/4420/4520 (Industrial)
PIC18LF2X1X/4X1X (Industrial) (Continued)
PIC18LF2X1X/4X1X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18FX42X/X52X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
ParamNo. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD;
MCLR
= VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.