Datasheet
PIC18F2420/2520/4420/4520
DS39631B-page 326 Preliminary © 2007 Microchip Technology Inc.
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2420/2520/4420/4520 (Industrial)
PIC18LF2X1X/4X1X (Industrial)
PIC18LF2X1X/4X1X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18FX42X/X52X
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
ParamNo. Device Typ Max Units Conditions
Power-down Current (I
PD)
(1)
PIC18LF2X1X/4X1X 20 950 nA -40°C
V
DD = 2.0V,
(Sleep mode)
0.02 1.0 μA +25°C
0.6 1.1 μA +85°C
PIC18LF2X1X/4X1X 0.03 1.4 μA-40°C
V
DD = 3.0V,
(Sleep mode)
0.03 1.5 μA +25°C
0.8 1.6 μA +85°C
All devices 0.04 1.9 μA-40°C
V
DD = 5.0V,
(Sleep mode)
0.04 2.0 μA +25°C
1.7 2.1 μA +85°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD;
MCLR
= VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in kΩ.
4: Standard low-cost 32 kHz crystals have an operating temperature range of -10°C to +70°C. Extended temperature
crystals are available at a much higher cost.
5: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be
less than the sum of both specifications.