Information

PIC18FXX2
DS80122K-page 12 © 2005 Microchip Technology Inc.
FIGURE 2: 44-PIN QFN PACKAGE
Contact Width
*Controlling Parameter
Drawing No. C04-103
Notes:
B .008 .013 .013 0.20 0.33 0.35
Pitch
Number of Contacts
Overall Width
Standoff
Overall Length
Overall Height
MAX
Units
Dimension Limits
A1
D
E
n
p
A
.000
INCHES
.026 BSC
MIN
44
NOM MAX
.002 0
MILLIMETERS*
.039
MIN
44
0.65 BSC
NOM
0.05
1.00
.010 REFBase Thickness A3 0.25 REF
0.90.035
.001 0.02
.315 8.00
Contact Length L .014 .016 .019 0.35 0.40 0.48
E2
D2
Exposed Pad Width
Exposed Pad Length .246 .268 .274 6.25 6.80 6.95
.246 .268 .274 6.25 6.80 6.95
D2
D
A1
A3
A
TOP VIEW
n
1
L
E2
BOTTOM VIEW
B
E
2
PAD
METAL
EXPOSED
p
PIN 1
INDEX ON
EXPOSED PAD
TOP MARKING
INDEX ON
OPTIONAL PIN 1
.031 0.80
DETAIL: CONTACT VARIANTS
7.85 8.15.321.309
.309 .315 8.007.85.321 8.15
22
11
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC equivalent: M0-220
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5M
See ASME Y14.5M
(PROFILE MAY VARY)
Revised 3-14-05
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)