Datasheet

PIC18(L)F2X/4XK22
DS41412F-page 526 2010-2012 Microchip Technology Inc.
29.2 Package Details
The following sections give the technical details of the packages.
 !
"#
 
 
 
 
 
"# 

 
   
 
 
 
   
  
   
    
   
   
   
    
   
  
NOTE 1
N
12
D
E1
eB
c
E
L
A2
eb
b1
A1
A
3
   