Datasheet

Table Of Contents
PIC18F2221/2321/4221/4321 FAMILY
DS39689F-page 346 © 2009 Microchip Technology Inc.
D025
(ΔI
OSCB)
Timer1 Oscillator 2.1 4.5 μA -40°C
(5)
VDD = 2.0V
32 kHz Tuning Fork,
Crystal on Timer1
Oscillator
(3)
—4.5μA-10°C
1.8 4.5 μA+25°C
2.1 4.5 μA+85°C
2.2 6.0 μA -40°C
(5)
VDD = 3.0V
—6μA-10°C
2.6 6.0 μA+25°C
2.9 6.0 μA+85°C
3.0 8.0 μA -40°C
(5)
VDD = 5.0V
—8μA-10°C
3.2 8.0 μA+25°C
3.4 8.0 μA+85°C
D026
(ΔI
AD)
A/D Converter 1.0 2.0 μA -40°C to +85°C V
DD = 2.0V
A/D on, Not Converting
1.0 2.0 μA -40°C to +85°C V
DD = 3.0V
1.0 2.0 μA -40°C to +85°C
V
DD = 5.0V
2.0 8.0 μA -40°C to +125°C
27.2 DC Characteristics: Power-Down and Supply Current
PIC18F2221/2321/4221/4321 (Industrial)
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)
PIC18LF2221/2321/4221/4321
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
PIC18F2221/2321/4221/4321
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +85°C for industrial
-40°C T
A +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS, and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) = 1.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
5: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0.