Datasheet
Table Of Contents
- Power-Managed Modes:
- Flexible Oscillator Structure:
- Peripheral Highlights:
- Peripheral Highlights (Continued):
- Special Microcontroller Features:
- Pin Diagrams
- Pin Diagrams (Continued)
- Pin Diagrams (Continued)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Guidelines for Getting Started with PIC18F Microcontrollers
- 3.0 Oscillator Configurations
- 4.0 Power-Managed Modes
- 5.0 Reset
- 5.1 RCON Register
- 5.2 Master Clear (MCLR)
- 5.3 Power-on Reset (POR)
- 5.4 Brown-out Reset (BOR)
- 5.5 Device Reset Timers
- 5.5.1 Power-up Timer (PWRT)
- 5.5.2 Oscillator Start-up Timer (OST)
- 5.5.3 PLL Lock Time-out
- 5.5.4 Time-out Sequence
- TABLE 5-2: Time-out in Various Situations
- FIGURE 5-3: Time-out Sequence on Power-up (MCLR Tied to Vdd, Vdd Rise < Tpwrt)
- FIGURE 5-4: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 1
- FIGURE 5-5: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 2
- FIGURE 5-6: Slow Rise Time (MCLR Tied to Vdd, Vdd Rise > Tpwrt)
- FIGURE 5-7: Time-out Sequence on POR w/PLL Enabled (MCLR Tied to Vdd)
- 5.6 Reset State of Registers
- 6.0 Memory Organization
- 6.1 Program Memory Organization
- 6.2 PIC18 Instruction Cycle
- 6.3 Data Memory Organization
- 6.4 Data Addressing Modes
- 6.5 Data Memory and the Extended Instruction Set
- 6.6 PIC18 Instruction Execution and the Extended Instruction Set
- 7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
- 7.4 Erasing Flash Program Memory
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
- 8.0 Data EEPROM Memory
- 9.0 8 X 8 Hardware Multiplier
- 9.1 Introduction
- 9.2 Operation
- EXAMPLE 9-1: 8 x 8 Unsigned Multiply Routine
- EXAMPLE 9-2: 8 x 8 Signed Multiply Routine
- TABLE 9-1: Performance Comparison for Various Multiply Operations
- EQUATION 9-1: 16 x 16 Unsigned Multiplication Algorithm
- EXAMPLE 9-3: 16 x 16 Unsigned Multiply Routine
- EQUATION 9-2: 16 x 16 Signed Multiplication Algorithm
- EXAMPLE 9-4: 16 x 16 Signed Multiply Routine
- 10.0 Interrupts
- 11.0 I/O Ports
- 12.0 Timer0 Module
- 13.0 Timer1 Module
- 14.0 Timer2 Module
- 15.0 Timer3 Module
- 16.0 Capture/Compare/PWM (CCP) Modules
- Register 16-1: CCPxCON Register (CCP2 Module, CCP1 Module in 28-pin Devices)
- 16.1 CCP Module Configuration
- 16.2 Capture Mode
- 16.3 Compare Mode
- 16.4 PWM Mode
- 17.0 Enhanced Capture/ Compare/PWM (ECCP) Module
- Register 17-1: CCP1CON Register (ECCP1 Module, 40/44-pin Devices)
- 17.1 ECCP Outputs and Configuration
- 17.2 Capture and Compare Modes
- 17.3 Standard PWM Mode
- 17.4 Enhanced PWM Mode
- 17.4.1 PWM Period
- 17.4.2 PWM Duty Cycle
- 17.4.3 PWM Output Configurations
- 17.4.4 Half-Bridge Mode
- 17.4.5 Full-Bridge Mode
- 17.4.6 Programmable Dead-Band Delay
- 17.4.7 Enhanced PWM Auto-Shutdown
- 17.4.8 Start-up Considerations
- 17.4.9 Setup for PWM Operation
- 17.4.10 Operation in Power-Managed Modes
- 17.4.11 Effects of a Reset
- 18.0 Master Synchronous Serial Port (MSSP) Module
- 18.1 Master SSP (MSSP) Module Overview
- 18.2 Control Registers
- 18.3 SPI Mode
- 18.4 I2C Mode
- FIGURE 18-7: MSSP Block Diagram (I2C™ Mode)
- 18.4.1 Registers
- 18.4.2 Operation
- 18.4.3 Slave Mode
- EXAMPLE 18-2: Address Masking
- FIGURE 18-8: I2C™ Slave Mode Timing with SEN = 0 (Reception, 7-Bit Addressing)
- FIGURE 18-9: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01011 (Reception, 7-bit Addressing)
- FIGURE 18-10: I2C™ Slave Mode Timing (Transmission, 7-Bit Addressing)
- FIGURE 18-11: I2C™ Slave Mode Timing with SEN = 0 and ADMSK = 01001 (Reception, 10-bit Addressing)
- FIGURE 18-12: I2C™ Slave Mode Timing with SEN = 0 (Reception, 10-Bit Addressing)
- FIGURE 18-13: I2C™ Slave Mode Timing (Transmission, 10-Bit Addressing)
- 18.4.4 Clock Stretching
- 18.4.5 General Call Address Support
- 18.4.6 Master Mode
- 18.4.7 Baud Rate
- 18.4.8 I2C Master Mode Start Condition Timing
- 18.4.9 I2C Master Mode Repeated Start Condition Timing
- 18.4.10 I2C Master Mode Transmission
- 18.4.11 I2C Master Mode Reception
- 18.4.12 Acknowledge Sequence Timing
- 18.4.13 Stop Condition Timing
- 18.4.14 Sleep Operation
- 18.4.15 Effects of a Reset
- 18.4.16 Multi-Master Mode
- 18.4.17 Multi -Master Communication, Bus Collision and Bus Arbitration
- FIGURE 18-27: Bus Collision Timing for Transmit and Acknowledge
- FIGURE 18-28: Bus Collision During Start Condition (SDA Only)
- FIGURE 18-29: Bus Collision During Start Condition (SCL = 0)
- FIGURE 18-30: BRG Reset Due to SDA Arbitration During Start Condition
- FIGURE 18-31: Bus Collision During a Repeated Start Condition (Case 1)
- FIGURE 18-32: Bus Collision During Repeated Start Condition (Case 2)
- FIGURE 18-33: Bus Collision During a Stop Condition (Case 1)
- FIGURE 18-34: Bus Collision During a Stop Condition (Case 2)
- TABLE 18-4: Registers Associated with I2C™ Operation
- 19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
- Register 19-1: TXSTA: Transmit Status And Control Register
- Register 19-2: RCSTA: Receive Status And Control Register
- Register 19-3: BAUDCON: Baud Rate Control Register
- 19.1 Baud Rate Generator (BRG)
- 19.2 EUSART Asynchronous Mode
- 19.3 EUSART Synchronous Master Mode
- 19.4 EUSART Synchronous Slave Mode
- 20.0 10-Bit Analog-to-Digital Converter (A/D) Module
- Register 20-1: ADCON0: A/D Control Register 0
- Register 20-2: ADCON1: A/D Control Register 1
- Register 20-3: ADCON2: A/D Control Register 2
- FIGURE 20-1: A/D Block Diagram
- FIGURE 20-2: A/D Transfer Function
- FIGURE 20-3: Analog Input Model
- 20.1 A/D Acquisition Requirements
- 20.2 Selecting and Configuring Acquisition Time
- 20.3 Selecting the A/D Conversion Clock
- 20.4 Operation in Power-Managed Modes
- 20.5 Configuring Analog Port Pins
- 20.6 A/D Conversions
- 20.7 Discharge
- 20.8 Use of the CCP2 Trigger
- 21.0 Comparator Module
- Register 21-1: CMCON: Comparator Control Register
- 21.1 Comparator Configuration
- 21.2 Comparator Operation
- 21.3 Comparator Reference
- 21.4 Comparator Response Time
- 21.5 Comparator Outputs
- 21.6 Comparator Interrupts
- 21.7 Comparator Operation During Sleep
- 21.8 Effects of a Reset
- 21.9 Analog Input Connection Considerations
- 22.0 Comparator Voltage Reference Module
- 23.0 High/Low-Voltage Detect (HLVD)
- 24.0 Special Features of the CPU
- 24.1 Configuration Bits
- TABLE 24-1: Configuration Bits and Device IDs
- Register 24-1: CONFIG1H: Configuration Register 1 High (Byte Address 300001h)
- Register 24-2: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 24-3: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 24-4: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 24-5: CONFIG4L: Configuration Register 4 Low (Byte Address 300006h)
- Register 24-6: CONFIG5L: Configuration Register 5 Low (Byte Address 300008h)
- Register 24-7: CONFIG5H: Configuration Register 5 High (Byte Address 300009h)
- Register 24-8: CONFIG6L: Configuration Register 6 Low (Byte Address 30000Ah)
- Register 24-9: CONFIG6H: Configuration Register 6 High (Byte Address 30000Bh)
- Register 24-10: CONFIG7L: Configuration Register 7 Low (Byte Address 30000Ch)
- Register 24-11: CONFIG7H: Configuration Register 7 High (Byte Address 30000Dh)
- Register 24-12: DEVID1: Device ID Register 1 for PIC18F2221/2321/4221/4321 Devices
- Register 24-13: DEVID2: Device ID Register 2 for PIC18F2221/2321/4221/4321 Devices
- 24.2 Watchdog Timer (WDT)
- 24.3 Two-Speed Start-up
- 24.4 Fail-Safe Clock Monitor
- 24.5 Program Verification and Code Protection
- 24.6 ID Locations
- 24.7 In-Circuit Serial Programming
- 24.8 In-Circuit Debugger
- 24.9 Single-Supply ICSP Programming
- 24.1 Configuration Bits
- 25.0 Instruction Set Summary
- 25.1 Standard Instruction Set
- 25.2 Extended Instruction Set
- 26.0 Development Support
- 27.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 27.1 DC Characteristics: Supply Voltage PIC18F2221/2321/4221/4321 (Industrial) PIC18LF2221/2321/4221/4321 (Industrial)
- 27.2 DC Characteristics: Power-Down and Supply Current PIC18F2221/2321/4221/4321 (Industrial) PIC18LF2221/2321/4221/4321 (Industrial)
- 27.3 DC Characteristics: PIC18F2221/2321/4221/4321 (Industrial) PIC18LF2221/2321/4221/4321 (Industrial)
- 27.4 AC (Timing) Characteristics
- 27.4.1 Timing Parameter Symbology
- 27.4.2 Timing Conditions
- 27.4.3 Timing Diagrams and Specifications
- FIGURE 27-6: External Clock Timing (All Modes Except PLL)
- TABLE 27-6: External Clock Timing Requirements
- TABLE 27-7: PLL Clock Timing Specifications (Vdd = 4.2V to 5.5V)
- TABLE 27-8: AC Characteristics: Internal RC Accuracy
- FIGURE 27-7: CLKO and I/O Timing
- TABLE 27-9: CLKO and I/O Timing Requirements
- FIGURE 27-8: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- FIGURE 27-9: Brown-out Reset Timing
- TABLE 27-10: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements
- FIGURE 27-10: Timer0 and Timer1 External Clock Timings
- TABLE 27-11: Timer0 and Timer1 External Clock Requirements
- FIGURE 27-11: Capture/Compare/PWM Timings (All CCP Modules)
- TABLE 27-12: Capture/Compare/PWM Requirements (All CCP Modules)
- FIGURE 27-12: Parallel Slave Port Timing (PIC18F4221/4321)
- TABLE 27-13: Parallel Slave Port Requirements (PIC18F4221/4321)
- FIGURE 27-13: Example SPI Master Mode Timing (CKE = 0)
- TABLE 27-14: Example SPI Mode Requirements (Master Mode, CKE = 0)
- FIGURE 27-14: Example SPI Master Mode Timing (CKE = 1)
- TABLE 27-15: Example SPI Mode Requirements (Master Mode, CKE = 1)
- FIGURE 27-15: Example SPI Slave Mode Timing (CKE = 0)
- TABLE 27-16: Example SPI Mode Requirements (Slave Mode Timing, CKE = 0)
- FIGURE 27-16: Example SPI Slave Mode Timing (CKE = 1)
- TABLE 27-17: Example SPI Slave Mode Requirements (CKE = 1)
- FIGURE 27-17: I2C™ Bus Start/Stop Bits Timing
- TABLE 27-18: I2C™ Bus Start/Stop Bits Requirements (Slave Mode)
- FIGURE 27-18: I2C™ Bus Data Timing
- TABLE 27-19: I2C™ Bus Data Requirements (Slave Mode)
- FIGURE 27-19: Master SSP I2C™ Bus Start/Stop Bits Timing Waveforms
- TABLE 27-20: Master SSP I2C™ Bus Start/Stop Bits Requirements
- FIGURE 27-20: Master SSP I2C™ Bus Data Timing
- TABLE 27-21: Master SSP I2C™ Bus Data Requirements
- FIGURE 27-21: EUSART Synchronous Transmission (Master/slave) Timing
- TABLE 27-22: EUSART Synchronous Transmission Requirements
- FIGURE 27-22: EUSART Synchronous Receive (Master/Slave) Timing
- TABLE 27-23: EUSART Synchronous Receive Requirements
- TABLE 27-24: A/D Converter Characteristics
- FIGURE 27-23: A/D Conversion Timing
- TABLE 27-25: A/D Conversion Requirements
- 28.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Device Differences
- Appendix C: Conversion Considerations
- Appendix D: Migration from Baseline to Enhanced Devices
- Appendix E: Migration From Mid-Range to Enhanced Devices
- Appendix F: Migration From High-End to Enhanced Devices
- INDEX
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- PIC18F2221/2321/4221/4321 Product Identification System
- Worldwide Sales and Service
PIC18F2221/2321/4221/4321 FAMILY
DS39689F-page 26 © 2009 Microchip Technology Inc.
2.2 Power Supply Pins
2.2.1 DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as V
DD, VSS, AVDD and
AV
SS, is required.
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A 0.1 μF (100 nF),
10-20V capacitor is recommended. The capacitor
should be a low-ESR device with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
• Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capaci-
tor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 μF to 0.001 μF. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1 μF in parallel with 0.001 μF).
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to
a minimum, thereby reducing PCB trace
inductance.
2.2.2 TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including microcontrollers to
supply a local power source. The value of the tank
capacitor should be determined based on the trace
resistance that connects the power supply source to
the device and the maximum current drawn by the
device in the application. In other words, select the tank
capacitor so that it meets the acceptable voltage sag at
the device. Typical values range from 4.7 μF to 47 μF.
2.3 Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions: device Reset, and device programming
and debugging. If programming and debugging are
not required in the end application, a direct
connection to V
DD may be all that is required. The
addition of other components, to help increase the
application’s resistance to spurious Resets from
voltage sags, may be beneficial. A typical
configuration is shown in Figure 2-1. Other circuit
designs may be implemented depending on the
application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR
pin. Consequently, specific voltage
levels (V
IH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR
pin during programming and
debugging operations by using a jumper (Figure 2-2).
The jumper is replaced for normal run-time
operations.
Any components associated with the MCLR
pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
Note 1: R1 ≤ 10 kΩ is recommended. A suggested
starting value is 10 kΩ. Ensure that the
MCLR
pin VIH and VIL specifications are met.
2: R2 ≤ 470Ω will limit any current flowing into
MCLR
from the external capacitor, C, in the
event of MCLR
pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C1
R2
R1
V
DD
MCLR
PIC18FXXXX
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