Information

PIC18F2221/2321/4221/4321
DS80310G-page 18 © 2008 Microchip Technology Inc.
Supply Current (IDD)
(2)
PIC18LF2X21/4X21 0.22 0.35 mA -40°C
V
DD = 2.0V
F
OSC = 1 MHz
(PRI_RUN,
EC oscillator)
0.22 0.35 mA +25°C
0.21 0.3 mA +85°C
PIC18LF2X21/4X21 0.51 0.55 mA -40°C
VDD = 3.0V0.45 0.50 mA +25°C
0.39 0.45 mA +85°C
All devices 1.14 1.15 mA -40°C
V
DD = 5.0V
0.99 1.1 mA +25°C
0.83 1.1 mA +85°C
Extended devices only 0.80 1.1 mA +125°C
PIC18LF2X21/4X21 610 870 μA-40°C
V
DD = 2.0V
F
OSC = 4 MHz
(PRI_RUN,
EC oscillator)
610 870 μA+25°C
610 870 μA+85°C
PIC18LF2X21/4X21 1.16 1.83 mA -40°C
VDD = 3.0V1.10 1.83 mA +25°C
1.07 1.83 mA +85°C
All devices 2.35 2.85 mA -40°C
V
DD = 5.0V
2.24 2.85 mA +25°C
2.14 2.85 mA +85°C
Extended devices only 2.14 2.85 mA +125°C
Extended devices only 9 15 mA +125°C V
DD = 4.2V FOSC = 25 MHz
(PRI_RUN,
EC oscillator)
12 20 mA +125°C
VDD = 5.0V
All devices 16 19 mA -40°C
V
DD = 4.2V
F
OSC = 40 MHz
(PRI_RUN,
EC oscillator)
14 19 mA +25°C
14 19 mA +85°C
All devices 17 22.7 mA -40°C
V
DD = 5.0V17 22.7 mA +25°C
17 22.7 mA +85°C
26.2 DC Characteristics: Power-Down and Supply Current
PIC18F2221/2321/4221/4321 (Industrial)
PIC18LF2221/2321/4221/4321 (Industrial) (Continued)
PIC18LF2221/2321/4221/4321
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
PIC18F2221/2321/4221/4321
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
-40°C ≤ T
A ≤ +125°C for extended
Param
No.
Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured
with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
DD or VSS and all features that
add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin
loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD or VSS;
MCLR
= VDD; WDT enabled/disabled as specified.
3: Low-power, Timer1 oscillator is selected unless otherwise indicated, where LPT1OSC (CONFIG3H<2>) =
1.
4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less
than the sum of both specifications.
5: When operation below -10°C is expected, use T1OSC high-power mode where LPT1OSC (CONFIG3H<2>) =
0.