Datasheet
Table Of Contents
- Power-Managed Modes:
- Flexible Oscillator Structure:
- Peripheral Highlights:
- Peripheral Highlights (Continued):
- Special Microcontroller Features:
- Pin Diagrams
- Pin Diagrams (Continued)
- Pin Diagrams (Continued)
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Guidelines for Getting Started with PIC18F Microcontrollers
- 3.0 Oscillator Configurations
- 4.0 Power-Managed Modes
- 5.0 Reset
- 5.1 RCON Register
- 5.2 Master Clear (MCLR)
- 5.3 Power-on Reset (POR)
- 5.4 Brown-out Reset (BOR)
- 5.5 Device Reset Timers
- 5.5.1 Power-up Timer (PWRT)
- 5.5.2 Oscillator Start-up Timer (OST)
- 5.5.3 PLL Lock Time-out
- 5.5.4 Time-out Sequence
- TABLE 5-2: Time-out in Various Situations
- FIGURE 5-3: Time-out Sequence on Power-up (MCLR Tied to Vdd, Vdd Rise < Tpwrt)
- FIGURE 5-4: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 1
- FIGURE 5-5: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 2
- FIGURE 5-6: Slow Rise Time (MCLR Tied to Vdd, Vdd Rise > Tpwrt)
- FIGURE 5-7: Time-out Sequence on POR w/PLL Enabled (MCLR Tied to Vdd)
- 5.6 Reset State of Registers
- 6.0 Memory Organization
- 6.1 Program Memory Organization
- 6.2 PIC18 Instruction Cycle
- 6.3 Data Memory Organization
- 6.4 Data Addressing Modes
- 6.5 Data Memory and the Extended Instruction Set
- 6.6 PIC18 Instruction Execution and the Extended Instruction Set
- 7.0 Flash Program Memory
- 7.1 Table Reads and Table Writes
- 7.2 Control Registers
- 7.3 Reading the Flash Program Memory
- 7.4 Erasing Flash Program Memory
- 7.5 Writing to Flash Program Memory
- 7.6 Flash Program Operation During Code Protection
- 8.0 Data EEPROM Memory
- 9.0 8 X 8 Hardware Multiplier
- 9.1 Introduction
- 9.2 Operation
- EXAMPLE 9-1: 8 x 8 Unsigned Multiply Routine
- EXAMPLE 9-2: 8 x 8 Signed Multiply Routine
- TABLE 9-1: Performance Comparison for Various Multiply Operations
- EQUATION 9-1: 16 x 16 Unsigned Multiplication Algorithm
- EXAMPLE 9-3: 16 x 16 Unsigned Multiply Routine
- EQUATION 9-2: 16 x 16 Signed Multiplication Algorithm
- EXAMPLE 9-4: 16 x 16 Signed Multiply Routine
- 10.0 Interrupts
- 11.0 I/O Ports
- 12.0 Timer0 Module
- 13.0 Timer1 Module
- 14.0 Timer2 Module
- 15.0 Timer3 Module
- 16.0 Capture/Compare/PWM (CCP) Modules
- Register 16-1: CCPxCON Register (CCP2 Module, CCP1 Module in 28-pin Devices)
- 16.1 CCP Module Configuration
- 16.2 Capture Mode
- 16.3 Compare Mode
- 16.4 PWM Mode
- 17.0 Enhanced Capture/ Compare/PWM (ECCP) Module
- Register 17-1: CCP1CON Register (ECCP1 Module, 40/44-pin Devices)
- 17.1 ECCP Outputs and Configuration
- 17.2 Capture and Compare Modes
- 17.3 Standard PWM Mode
- 17.4 Enhanced PWM Mode
- 17.4.1 PWM Period
- 17.4.2 PWM Duty Cycle
- 17.4.3 PWM Output Configurations
- 17.4.4 Half-Bridge Mode
- 17.4.5 Full-Bridge Mode
- 17.4.6 Programmable Dead-Band Delay
- 17.4.7 Enhanced PWM Auto-Shutdown
- 17.4.8 Start-up Considerations
- 17.4.9 Setup for PWM Operation
- 17.4.10 Operation in Power-Managed Modes
- 17.4.11 Effects of a Reset
- 18.0 Master Synchronous Serial Port (MSSP) Module
- 18.1 Master SSP (MSSP) Module Overview
- 18.2 Control Registers
- 18.3 SPI Mode
- 18.4 I2C Mode
- FIGURE 18-7: MSSP Block Diagram (I2C™ Mode)
- 18.4.1 Registers
- 18.4.2 Operation
- 18.4.3 Slave Mode
- EXAMPLE 18-2: Address Masking
- FIGURE 18-8: I2C™ Slave Mode Timing with SEN = 0 (Reception, 7-Bit Addressing)
- FIGURE 18-9: I2C™ Slave Mode Timing with SEN = 0 and ADMSK<5:1> = 01011 (Reception, 7-bit Addressing)
- FIGURE 18-10: I2C™ Slave Mode Timing (Transmission, 7-Bit Addressing)
- FIGURE 18-11: I2C™ Slave Mode Timing with SEN = 0 and ADMSK = 01001 (Reception, 10-bit Addressing)
- FIGURE 18-12: I2C™ Slave Mode Timing with SEN = 0 (Reception, 10-Bit Addressing)
- FIGURE 18-13: I2C™ Slave Mode Timing (Transmission, 10-Bit Addressing)
- 18.4.4 Clock Stretching
- 18.4.5 General Call Address Support
- 18.4.6 Master Mode
- 18.4.7 Baud Rate
- 18.4.8 I2C Master Mode Start Condition Timing
- 18.4.9 I2C Master Mode Repeated Start Condition Timing
- 18.4.10 I2C Master Mode Transmission
- 18.4.11 I2C Master Mode Reception
- 18.4.12 Acknowledge Sequence Timing
- 18.4.13 Stop Condition Timing
- 18.4.14 Sleep Operation
- 18.4.15 Effects of a Reset
- 18.4.16 Multi-Master Mode
- 18.4.17 Multi -Master Communication, Bus Collision and Bus Arbitration
- FIGURE 18-27: Bus Collision Timing for Transmit and Acknowledge
- FIGURE 18-28: Bus Collision During Start Condition (SDA Only)
- FIGURE 18-29: Bus Collision During Start Condition (SCL = 0)
- FIGURE 18-30: BRG Reset Due to SDA Arbitration During Start Condition
- FIGURE 18-31: Bus Collision During a Repeated Start Condition (Case 1)
- FIGURE 18-32: Bus Collision During Repeated Start Condition (Case 2)
- FIGURE 18-33: Bus Collision During a Stop Condition (Case 1)
- FIGURE 18-34: Bus Collision During a Stop Condition (Case 2)
- TABLE 18-4: Registers Associated with I2C™ Operation
- 19.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
- Register 19-1: TXSTA: Transmit Status And Control Register
- Register 19-2: RCSTA: Receive Status And Control Register
- Register 19-3: BAUDCON: Baud Rate Control Register
- 19.1 Baud Rate Generator (BRG)
- 19.2 EUSART Asynchronous Mode
- 19.3 EUSART Synchronous Master Mode
- 19.4 EUSART Synchronous Slave Mode
- 20.0 10-Bit Analog-to-Digital Converter (A/D) Module
- Register 20-1: ADCON0: A/D Control Register 0
- Register 20-2: ADCON1: A/D Control Register 1
- Register 20-3: ADCON2: A/D Control Register 2
- FIGURE 20-1: A/D Block Diagram
- FIGURE 20-2: A/D Transfer Function
- FIGURE 20-3: Analog Input Model
- 20.1 A/D Acquisition Requirements
- 20.2 Selecting and Configuring Acquisition Time
- 20.3 Selecting the A/D Conversion Clock
- 20.4 Operation in Power-Managed Modes
- 20.5 Configuring Analog Port Pins
- 20.6 A/D Conversions
- 20.7 Discharge
- 20.8 Use of the CCP2 Trigger
- 21.0 Comparator Module
- Register 21-1: CMCON: Comparator Control Register
- 21.1 Comparator Configuration
- 21.2 Comparator Operation
- 21.3 Comparator Reference
- 21.4 Comparator Response Time
- 21.5 Comparator Outputs
- 21.6 Comparator Interrupts
- 21.7 Comparator Operation During Sleep
- 21.8 Effects of a Reset
- 21.9 Analog Input Connection Considerations
- 22.0 Comparator Voltage Reference Module
- 23.0 High/Low-Voltage Detect (HLVD)
- 24.0 Special Features of the CPU
- 24.1 Configuration Bits
- TABLE 24-1: Configuration Bits and Device IDs
- Register 24-1: CONFIG1H: Configuration Register 1 High (Byte Address 300001h)
- Register 24-2: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 24-3: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 24-4: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 24-5: CONFIG4L: Configuration Register 4 Low (Byte Address 300006h)
- Register 24-6: CONFIG5L: Configuration Register 5 Low (Byte Address 300008h)
- Register 24-7: CONFIG5H: Configuration Register 5 High (Byte Address 300009h)
- Register 24-8: CONFIG6L: Configuration Register 6 Low (Byte Address 30000Ah)
- Register 24-9: CONFIG6H: Configuration Register 6 High (Byte Address 30000Bh)
- Register 24-10: CONFIG7L: Configuration Register 7 Low (Byte Address 30000Ch)
- Register 24-11: CONFIG7H: Configuration Register 7 High (Byte Address 30000Dh)
- Register 24-12: DEVID1: Device ID Register 1 for PIC18F2221/2321/4221/4321 Devices
- Register 24-13: DEVID2: Device ID Register 2 for PIC18F2221/2321/4221/4321 Devices
- 24.2 Watchdog Timer (WDT)
- 24.3 Two-Speed Start-up
- 24.4 Fail-Safe Clock Monitor
- 24.5 Program Verification and Code Protection
- 24.6 ID Locations
- 24.7 In-Circuit Serial Programming
- 24.8 In-Circuit Debugger
- 24.9 Single-Supply ICSP Programming
- 24.1 Configuration Bits
- 25.0 Instruction Set Summary
- 25.1 Standard Instruction Set
- 25.2 Extended Instruction Set
- 26.0 Development Support
- 27.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 27.1 DC Characteristics: Supply Voltage PIC18F2221/2321/4221/4321 (Industrial) PIC18LF2221/2321/4221/4321 (Industrial)
- 27.2 DC Characteristics: Power-Down and Supply Current PIC18F2221/2321/4221/4321 (Industrial) PIC18LF2221/2321/4221/4321 (Industrial)
- 27.3 DC Characteristics: PIC18F2221/2321/4221/4321 (Industrial) PIC18LF2221/2321/4221/4321 (Industrial)
- 27.4 AC (Timing) Characteristics
- 27.4.1 Timing Parameter Symbology
- 27.4.2 Timing Conditions
- 27.4.3 Timing Diagrams and Specifications
- FIGURE 27-6: External Clock Timing (All Modes Except PLL)
- TABLE 27-6: External Clock Timing Requirements
- TABLE 27-7: PLL Clock Timing Specifications (Vdd = 4.2V to 5.5V)
- TABLE 27-8: AC Characteristics: Internal RC Accuracy
- FIGURE 27-7: CLKO and I/O Timing
- TABLE 27-9: CLKO and I/O Timing Requirements
- FIGURE 27-8: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- FIGURE 27-9: Brown-out Reset Timing
- TABLE 27-10: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset Requirements
- FIGURE 27-10: Timer0 and Timer1 External Clock Timings
- TABLE 27-11: Timer0 and Timer1 External Clock Requirements
- FIGURE 27-11: Capture/Compare/PWM Timings (All CCP Modules)
- TABLE 27-12: Capture/Compare/PWM Requirements (All CCP Modules)
- FIGURE 27-12: Parallel Slave Port Timing (PIC18F4221/4321)
- TABLE 27-13: Parallel Slave Port Requirements (PIC18F4221/4321)
- FIGURE 27-13: Example SPI Master Mode Timing (CKE = 0)
- TABLE 27-14: Example SPI Mode Requirements (Master Mode, CKE = 0)
- FIGURE 27-14: Example SPI Master Mode Timing (CKE = 1)
- TABLE 27-15: Example SPI Mode Requirements (Master Mode, CKE = 1)
- FIGURE 27-15: Example SPI Slave Mode Timing (CKE = 0)
- TABLE 27-16: Example SPI Mode Requirements (Slave Mode Timing, CKE = 0)
- FIGURE 27-16: Example SPI Slave Mode Timing (CKE = 1)
- TABLE 27-17: Example SPI Slave Mode Requirements (CKE = 1)
- FIGURE 27-17: I2C™ Bus Start/Stop Bits Timing
- TABLE 27-18: I2C™ Bus Start/Stop Bits Requirements (Slave Mode)
- FIGURE 27-18: I2C™ Bus Data Timing
- TABLE 27-19: I2C™ Bus Data Requirements (Slave Mode)
- FIGURE 27-19: Master SSP I2C™ Bus Start/Stop Bits Timing Waveforms
- TABLE 27-20: Master SSP I2C™ Bus Start/Stop Bits Requirements
- FIGURE 27-20: Master SSP I2C™ Bus Data Timing
- TABLE 27-21: Master SSP I2C™ Bus Data Requirements
- FIGURE 27-21: EUSART Synchronous Transmission (Master/slave) Timing
- TABLE 27-22: EUSART Synchronous Transmission Requirements
- FIGURE 27-22: EUSART Synchronous Receive (Master/Slave) Timing
- TABLE 27-23: EUSART Synchronous Receive Requirements
- TABLE 27-24: A/D Converter Characteristics
- FIGURE 27-23: A/D Conversion Timing
- TABLE 27-25: A/D Conversion Requirements
- 28.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Device Differences
- Appendix C: Conversion Considerations
- Appendix D: Migration from Baseline to Enhanced Devices
- Appendix E: Migration From Mid-Range to Enhanced Devices
- Appendix F: Migration From High-End to Enhanced Devices
- INDEX
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- PIC18F2221/2321/4221/4321 Product Identification System
- Worldwide Sales and Service
© 2009 Microchip Technology Inc. DS39689F-page 49
PIC18F2221/2321/4221/4321 FAMILY
5.2 Master Clear (MCLR)
The MCLR pin provides a method for triggering an
external Reset of the device. A Reset is generated by
holding the pin low. These devices have a noise filter in
the MCLR
Reset path which detects and ignores small
pulses.
The MCLR
pin is not driven low by any internal Resets,
including the WDT.
In PIC18F2221/2321/4221/4321 family devices, the
MCLR
input can be disabled with the MCLRE Configu-
ration bit. When MCLR
is disabled, the pin becomes a
digital input. See Section 11.5 “PORTE, TRISE and
LATE Registers” for more information.
5.3 Power-on Reset (POR)
A Power-on Reset pulse is generated on-chip
whenever V
DD rises above a certain threshold. This
allows the device to start in the initialized state when
VDD is adequate for operation.
To take advantage of the POR circuitry, tie the MCLR
pin through a resistor (1 kΩ to 10 kΩ) to VDD. This will
eliminate external RC components usually needed to
create a Power-on Reset delay. A minimum rise rate for
V
DD is specified (parameter D004). For a slow rise
time, see Figure 5-2.
When the device starts normal operation (i.e., exits the
Reset condition), device operating parameters
(voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not met, the
device must be held in Reset until the operating
conditions are met.
Power-on Reset events are captured by the POR
bit
(RCON<1>). The state of the bit is set to ‘0’ whenever
a POR occurs; it does not change for any other Reset
event. POR
is not reset to ‘1’ by any hardware event.
To capture multiple events, the user manually resets
the bit to ‘1’ in software following any POR.
FIGURE 5-2: EXTERNAL POWER-ON
RESET CIRCUIT (FOR
SLOW V
DD POWER-UP)
Note 1: External Power-on Reset circuit is required
only if the V
DD power-up slope is too slow.
The diode D helps discharge the capacitor
quickly when V
DD powers down.
2: R < 40 kΩ is recommended to make sure that
the voltage drop across R does not violate
the device’s electrical specification.
3: R1 ≥ 1 kΩ will limit any current flowing into
MCLR
from external capacitor C, in the event
of MCLR
/VPP pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS).
C
R1
R
D
V
DD
MCLR
PIC18FXXXX
VDD