Datasheet

PIC18(L)F1XK22
DS41365E-page 6 2009-2011 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Module........................................................................................................................................................................ 13
3.0 Memory Organization ................................................................................................................................................................. 25
4.0 Flash Program Memory .............................................................................................................................................................. 47
5.0 Data EEPROM Memory ............................................................................................................................................................. 57
6.0 8x8 Hardware Multiplier.............................................................................................................................................................. 61
7.0 Interrupts .................................................................................................................................................................................... 63
8.0 I/O Ports ..................................................................................................................................................................................... 77
9.0 Timer0 Module ........................................................................................................................................................................... 95
10.0 Timer1 Module ........................................................................................................................................................................... 99
11.0 Timer2 Module ......................................................................................................................................................................... 105
12.0 Timer3 Module ......................................................................................................................................................................... 107
13.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 111
14.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 133
15.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 175
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 203
17.0 Comparator Module.................................................................................................................................................................. 217
18.0 Power-Managed Modes ........................................................................................................................................................... 229
19.0 SR Latch................................................................................................................................................................................... 235
20.0 Voltage References.................................................................................................................................................................. 239
21.0 Reset ........................................................................................................................................................................................ 245
22.0 Special Features of the CPU.................................................................................................................................................... 257
23.0 Instruction Set Summary .......................................................................................................................................................... 273
24.0 Development Support............................................................................................................................................................... 323
25.0 Electrical Specifications............................................................................................................................................................ 327
26.0 DC and AC Characteristics Graphs and Tables ....................................................................................................................... 363
27.0 Packaging Information.............................................................................................................................................................. 379
Appendix A: Revision History............................................................................................................................................................. 389
Appendix B: Device Differences......................................................................................................................................................... 389
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