Datasheet

PIC18(L)F1XK22
DS41365E-page 344 2009-2011 Microchip Technology Inc.
25.11 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
A +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01
JA Thermal Resistance Junction to Ambient 62.2 C/W 20-pin PDIP package
75.0 C/W 20-pin SOIC package
89.3 C/W 20-pin SSOP package
43.0 C/W 20-pin QFN 4x4mm package
TH02
JC Thermal Resistance Junction to Case 27.5 C/W 20-pin PDIP package
23.1 C/W 20-pin SOIC package
31.1 C/W 20-pin SSOP package
5.3 C/W 20-pin QFN 4x4mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation W PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
TH07 P
DER Derated Power W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature.
3: T
J = Junction Temperature.