Datasheet

PIC18F1230/1330
DS39758D-page 6  2009 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 17
3.0 Oscillator Configurations ............................................................................................................................................................ 21
4.0 Power-Managed Modes ............................................................................................................................................................. 31
5.0 Reset .......................................................................................................................................................................................... 39
6.0 Memory Organization ................................................................................................................................................................. 51
7.0 Flash Program Memory.............................................................................................................................................................. 71
8.0 Data EEPROM Memory ............................................................................................................................................................. 81
9.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 85
10.0 I/O Ports ..................................................................................................................................................................................... 87
11.0 Interrupts .................................................................................................................................................................................... 93
12.0 Timer0 Module ......................................................................................................................................................................... 107
13.0 Timer1 Module ......................................................................................................................................................................... 111
14.0 Power Control PWM Module .................................................................................................................................................... 117
15.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 147
16.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 169
17.0 Comparator Module.................................................................................................................................................................. 179
18.0 Comparator Voltage Reference Module................................................................................................................................... 183
19.0 Low-Voltage Detect (LVD)........................................................................................................................................................ 187
20.0 Special Features of
the CPU191
21.0 Development Support............................................................................................................................................................... 211
22.0 Instruction Set Summary .......................................................................................................................................................... 215
23.0 Electrical Characteristics .......................................................................................................................................................... 265
24.0 Packaging Information.............................................................................................................................................................. 295
Appendix A: Revision History............................................................................................................................................................. 303
Appendix B: Device Differences......................................................................................................................................................... 304
Appendix C: Conversion Considerations ........................................................................................................................................... 305
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 305
Appendix E: Migration from Mid-Range TO Enhanced Devices ........................................................................................................ 306
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 306
Index .................................................................................................................................................................................................. 307