Datasheet
Table Of Contents
- Low-Power Features:
- Oscillators:
- Peripheral Highlights:
- Special Microcontroller Features:
- Pin Diagrams
- Table of Contents
- Most Current Data Sheet
- Errata
- Customer Notification System
- 1.0 Device Overview
- 2.0 Oscillator Configurations
- 3.0 Power Managed Modes
- 4.0 Reset
- FIGURE 4-1: Simplified Block Diagram of On-Chip Reset Circuit
- 4.1 Power-on Reset (POR)
- 4.2 Power-up Timer (PWRT)
- 4.3 Oscillator Start-up Timer (OST)
- 4.4 PLL Lock Time-out
- 4.5 Brown-out Reset (BOR)
- 4.6 Time-out Sequence
- TABLE 4-1: Time-out in Various Situations
- Register 4-1: RCON Register Bits and Positions
- TABLE 4-2: Status Bits, Their Significance and the Initialization Condition for RCON Register
- TABLE 4-3: Initialization Conditions for All Registers
- FIGURE 4-3: Time-out Sequence on Power-up (MCLR Tied to Vdd, Vdd Rise < Tpwrt)
- FIGURE 4-4: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 1
- FIGURE 4-5: Time-out Sequence on Power-up (MCLR Not Tied to Vdd): Case 2
- FIGURE 4-6: Slow Rise Time (MCLR Tied to Vdd, Vdd Rise > Tpwrt)
- FIGURE 4-7: Time-out Sequence on POR W/PLL Enabled (MCLR Tied to Vdd)
- 5.0 Memory Organization
- FIGURE 5-1: Program Memory Map and Stack for PIC18F1220
- 5.1 Program Memory Organization
- 5.2 Return Address Stack
- 5.3 Fast Register Stack
- 5.4 PCL, PCLATH and PCLATU
- 5.5 Clocking Scheme/Instruction Cycle
- 5.6 Instruction Flow/Pipelining
- 5.7 Instructions in Program Memory
- 5.8 Look-up Tables
- 5.9 Data Memory Organization
- 5.10 Access Bank
- 5.11 Bank Select Register (BSR)
- 5.12 Indirect Addressing, INDF and FSR Registers
- 5.13 Status Register
- 5.14 RCON Register
- 6.0 Flash Program Memory
- 7.0 Data EEPROM Memory
- 8.0 8 X 8 Hardware Multiplier
- 9.0 Interrupts
- 10.0 I/O Ports
- FIGURE 10-1: Generic I/O Port Operation
- 10.1 PORTA, TRISA and LATA Registers
- EXAMPLE 10-1: Initializing PORTA
- FIGURE 10-2: Block Diagram of RA3:RA0 Pins
- FIGURE 10-3: Block Diagram of OSC2/CLKO/RA6 Pin
- FIGURE 10-4: Block Diagram of RA4/T0CKI Pin
- FIGURE 10-5: Block Diagram of OSC1/CLKI/RA7 Pin
- FIGURE 10-6: MCLR/Vpp/RA5 Pin Block Diagram
- TABLE 10-1: PORTA Functions
- TABLE 10-2: Summary of Registers Associated with PORTA
- 10.2 PORTB, TRISB and LATB Registers
- EXAMPLE 10-2: Initializing PORTB
- FIGURE 10-7: Block Diagram of RB0/AN4/INT0 Pin
- FIGURE 10-8: Block Diagram of RB1/AN5/TX/CK/INT1 Pin
- FIGURE 10-9: Block Diagram of RB2/P1B/INT2 Pin
- FIGURE 10-10: Block Diagram of RB3/CCP1/P1A Pin
- FIGURE 10-11: Block Diagram of RB4/AN6/RX/DT/KBI0 Pin
- FIGURE 10-12: Block Diagram of RB5/PGM/KBI1 Pin
- FIGURE 10-13: Block Diagram of RB6/PGC/T1OSO/T13CKI/P1C/KBI2 Pin
- FIGURE 10-14: Block Diagram of RB7/PGD/T1OSI/P1D/KBI3 Pin
- TABLE 10-3: PORTB Functions
- TABLE 10-4: Summary of Registers Associated with PORTB
- 11.0 Timer0 Module
- 12.0 Timer1 Module
- 13.0 Timer2 Module
- 14.0 Timer3 Module
- 15.0 Enhanced Capture/ Compare/PWM (ECCP) Module
- Register 15-1: CCP1CON Register for Enhanced CCP Operation
- 15.1 ECCP Outputs
- 15.2 CCP Module
- 15.3 Capture Mode
- 15.4 Compare Mode
- 15.5 Enhanced PWM Mode
- 15.5.1 PWM Period
- 15.5.2 PWM Duty Cycle
- 15.5.3 PWM Output Configurations
- 15.5.4 Half-Bridge Mode
- 15.5.5 Full-Bridge Mode
- 15.5.6 Programmable Dead-Band Delay
- 15.5.7 Enhanced PWM Auto-Shutdown
- 15.5.8 Start-up Considerations
- 15.5.9 Setup for PWM Operation
- 15.5.10 Operation in Low-Power Modes
- 15.5.11 Effects of a Reset
- 16.0 Enhanced Addressable Universal Synchronous Asynchronous Receiver Transmitter (EUSART)
- 16.1 Asynchronous Operation in Power Managed Modes
- 16.2 EUSART Baud Rate Generator (BRG)
- 16.3 EUSART Asynchronous Mode
- 16.4 EUSART Synchronous Master Mode
- 16.5 EUSART Synchronous Slave Mode
- 17.0 10-Bit Analog-to-Digital Converter (A/D) Module
- Register 17-1: ADCON0: A/D Control Register 0
- Register 17-2: ADCON1: A/D Control Register 1
- Register 17-3: ADCON2: A/D Control Register 2
- FIGURE 17-1: A/D Block Diagram
- FIGURE 17-2: Analog Input Model
- 17.1 A/D Acquisition Requirements
- 17.2 A/D Vref+ and Vref- References
- 17.3 Selecting and Configuring Automatic Acquisition Time
- 17.4 Selecting the A/D Conversion Clock
- 17.5 Operation in Low-Power Modes
- 17.6 Configuring Analog Port Pins
- 17.7 A/D Conversions
- 17.8 Use of the CCP1 Trigger
- 18.0 Low-Voltage Detect
- 19.0 Special Features of the CPU
- 19.1 Configuration Bits
- TABLE 19-1: Configuration Bits and Device IDs
- Register 19-1: CONFIG1H: Configuration Register 1 High (Byte Address 300001h)
- Register 19-2: CONFIG2L: Configuration Register 2 Low (Byte Address 300002h)
- Register 19-3: CONFIG2H: Configuration Register 2 High (Byte Address 300003h)
- Register 19-4: CONFIG3H: Configuration Register 3 High (Byte Address 300005h)
- Register 19-5: CONFIG4L: Configuration Register 4 Low (Byte Address 300006h)
- Register 19-6: CONFIG5L: Configuration Register 5 Low (Byte Address 300008h)
- Register 19-7: CONFIG5H: Configuration Register 5 High (Byte Address 300009h)
- Register 19-8: CONFIG6L: Configuration Register 6 Low (Byte Address 30000Ah)
- Register 19-9: CONFIG6H: Configuration Register 6 High (Byte Address 30000Bh)
- Register 19-10: CONFIG7L: Configuration Register 7 Low (Byte Address 30000Ch)
- Register 19-11: CONFIG7H: Configuration Register 7 High (Byte Address 30000Dh)
- Register 19-12: DEVID1: Device ID Register 1 for PIC18F1220/1320 Devices
- Register 19-13: DEVID2: Device ID Register 2 for PIC18F1220/1320 Devices
- 19.2 Watchdog Timer (WDT)
- 19.3 Two-Speed Start-up
- 19.4 Fail-Safe Clock Monitor
- 19.5 Program Verification and Code Protection
- 19.6 ID Locations
- 19.7 In-Circuit Serial Programming
- 19.8 In-Circuit Debugger
- 19.9 Low-Voltage ICSP Programming
- 19.1 Configuration Bits
- 20.0 Instruction Set Summary
- 21.0 Development Support
- 21.1 MPLAB Integrated Development Environment Software
- 21.2 MPASM Assembler
- 21.3 MPLAB C18 and MPLAB C30 C Compilers
- 21.4 MPLINK Object Linker/ MPLIB Object Librarian
- 21.5 MPLAB ASM30 Assembler, Linker and Librarian
- 21.6 MPLAB SIM Software Simulator
- 21.7 MPLAB ICE 2000 High-Performance In-Circuit Emulator
- 21.8 MPLAB REAL ICE In-Circuit Emulator System
- 21.9 MPLAB ICD 2 In-Circuit Debugger
- 21.10 MPLAB PM3 Device Programmer
- 21.11 PICSTART Plus Development Programmer
- 21.12 PICkit 2 Development Programmer
- 21.13 Demonstration, Development and Evaluation Boards
- 22.0 Electrical Characteristics
- Absolute Maximum Ratings(†)
- 22.1 DC Characteristics: Supply Voltage PIC18F1220/1320 (Industrial) PIC18LF1220/1320 (Industrial)
- 22.2 DC Characteristics: Power-Down and Supply Current PIC18F1220/1320 (Industrial) PIC18LF1220/1...
- 22.3 DC Characteristics: PIC18F1220/1320 (Industrial) PIC18LF1220/1320 (Industrial)
- 22.4 AC (Timing) Characteristics
- 22.4.1 Timing Parameter Symbology
- 22.4.2 Timing Conditions
- 22.4.3 Timing Diagrams and Specifications
- FIGURE 22-6: External Clock Timing (All Modes Except PLL)
- TABLE 22-4: External Clock Timing Requirements
- TABLE 22-5: PLL Clock Timing Specifications, HS/HSPLL Mode (Vdd = 4.2V to 5.5V)
- TABLE 22-6: Internal RC Accuracy: PIC18F1220/1320 (INDUSTRIAL) PIC18LF1220/1320 (INDUSTRIAL)
- FIGURE 22-7: CLKO and I/O Timing
- TABLE 22-7: CLKO and I/O Timing Requirements
- FIGURE 22-8: Reset, Watchdog Timer, Oscillator Start-up Timer and Power-up Timer Timing
- FIGURE 22-9: Brown-out Reset Timing
- TABLE 22-8: Reset, Watchdog Timer, Oscillator Start-up Timer, Power-up Timer and Brown-out Reset ...
- FIGURE 22-10: Timer0 and Timer1 External Clock Timings
- TABLE 22-9: Timer0 and Timer1 External Clock Requirements
- FIGURE 22-11: Capture/Compare/PWM Timings (All CCP Modules)
- TABLE 22-10: Capture/Compare/PWM Requirements (All CCP Modules)
- FIGURE 22-12: EUSART Synchronous Transmission (Master/Slave) Timing
- TABLE 22-11: EUSART Synchronous Transmission Requirements
- FIGURE 22-13: EUSART Synchronous Receive (Master/Slave) Timing
- TABLE 22-12: EUSART Synchronous Receive Requirements
- TABLE 22-13: A/D Converter Characteristics: PIC18F1220/1320 (Industrial) PIC18LF1220/1320 (Indust...
- FIGURE 22-14: A/D Conversion Timing
- TABLE 22-14: A/D Conversion Requirements
- 23.0 DC and AC Characteristics Graphs and Tables
- FIGURE 23-1: Typical Idd vs. Fosc Over Vdd PRI_RUN, EC Mode, +25˚C
- FIGURE 23-2: Maximum Idd vs. Fosc Over Vdd PRI_RUN, EC Mode, -40˚C to +85˚C
- FIGURE 23-3: Maximum Idd vs. Fosc Over Vdd PRI_RUN, EC Mode, -40˚C to +125˚C
- FIGURE 23-4: Typical Idd vs. Fosc Over Vdd PRI_RUN, EC Mode, +25˚C
- FIGURE 23-5: Maximum Idd vs. Fosc Over Vdd PRI_RUN, EC Mode, -40˚C to +125˚C
- FIGURE 23-6: Typical Idd vs. Fosc Over Vdd PRI_RUN, EC Mode, +25˚C
- FIGURE 23-7: Maximum Idd vs. Fosc Over Vdd PRI_RUN, EC Mode, -40˚C to +125˚C
- FIGURE 23-8: Typical Idd vs. Fosc Over Vdd PRI_IDLE, EC Mode, +25˚C
- FIGURE 23-9: Maximum Idd vs. Fosc Over Vdd PRI_IDLE, EC Mode, -40˚C to +85˚C
- FIGURE 23-10: Maximum Idd vs. Fosc Over Vdd PRI_IDLE, EC Mode, -40˚C to +125˚C
- FIGURE 23-11: Typical Idd vs. Fosc Over Vdd PRI_IDLE, EC Mode, +25˚C
- FIGURE 23-12: Maximum Idd vs. Fosc Over Vdd PRI_IDLE, EC Mode, -40˚C to +125˚C
- FIGURE 23-13: Typical Idd vs. Fosc Over Vdd PRI_IDLE, EC Mode, +25˚C
- FIGURE 23-14: Maximum Idd vs. Fosc Over Vdd PRI_IDLE, EC Mode, -40˚C to +125˚C
- FIGURE 23-15: Typical Ipd vs. Vdd (+25˚C), 125 kHz to 8 MHz RC_RUN Mode, All Peripherals Disabled
- FIGURE 23-16: Maximum Ipd vs. Vdd (-40˚C to +125˚C), 125 kHz to 8 MHz RC_RUN Mode, All Peripheral...
- FIGURE 23-17: Typical and Maximum Ipd vs. Vdd (-40˚C to +125˚C), 31.25 kHz RC_RUN Mode, All Perip...
- FIGURE 23-18: Typical Ipd vs. Vdd (+25˚C), 125 kHz to 8 MHz RC_IDLE Mode, All Peripherals Disabled
- FIGURE 23-19: Maximum Ipd vs. Vdd (-40˚C to +125˚C), 125 kHz to 8 MHz RC_IDLE Mode, All Periphera...
- FIGURE 23-20: Typical and Maximum Ipd vs. Vdd (-40˚C to +125˚C), 31.25 kHz RC_IDLE Mode, All Peri...
- FIGURE 23-21: Ipd SEC_RUN Mode, -10˚C to +70˚C, 32.768 kHz XTAL, 2 x 22 pF, All Peripherals Disabled
- FIGURE 23-22: Ipd SEC_IDLE Mode, -10˚C to +70˚C, 32.768 kHz, 2 x 22 pF, All Peripherals Disabled
- FIGURE 23-23: Total Ipd, -40˚C to +125˚C Sleep Mode, All Peripherals Disabled
- FIGURE 23-24: Voh vs. Ioh Over Temperature (-40˚C to +125˚C), Vdd = 3.0V
- FIGURE 23-25: Voh vs. Ioh Over Temperature (-40˚C to +125˚C), Vdd = 5.0V
- FIGURE 23-26: Vol vs. Iol Over Temperature (-40˚C to +125˚C), Vdd = 3.0V
- FIGURE 23-27: Vol vs. Iol Over Temperature (-40˚C to +125˚C), Vdd = 5.0V
- FIGURE 23-28: DIpd Timer1 Oscillator, -10˚C to +70˚C Sleep Mode, TMR1 Counter Disabled
- FIGURE 23-29: DIpd FSCM vs. Vdd Over Temperature PRI_IDLE Mode, EC Oscillator at 32 kHz, -40˚C to...
- FIGURE 23-30: DIpd WDT, -40˚C to +125˚C Sleep Mode, All Peripherals Disabled
- FIGURE 23-31: DIpd LVD vs. Vdd Sleep Mode, LVDL3:LVDL0 = 0001 (2V)
- FIGURE 23-32: DIpd BOR vs. Vdd, -40˚C to +125˚C Sleep Mode, BORV1:BORV0 = 11 (2V)
- FIGURE 23-33: DIpd A/D, -40˚C to +125˚C Sleep Mode, A/D Enabled (Not Converting)
- FIGURE 23-34: Average Fosc vs. Vdd for Various R’s External RC Mode, C = 20 pF, Temperature = +25˚C
- FIGURE 23-35: Average Fosc vs. Vdd for Various R’s External RC Mode, C = 100 pF, Temperature = +25˚C
- FIGURE 23-36: Average Fosc vs. Vdd for Various R’s External RC Mode, C = 300 pF, Temperature = +25˚C
- 24.0 Packaging Information
- Appendix A: Revision History
- Appendix B: Device Differences
- Appendix C: Conversion Considerations
- Appendix D: Migration from Baseline to Enhanced Devices
- Appendix E: Migration from Mid-Range to Enhanced Devices
- Appendix F: Migration from High-End to Enhanced Devices
- INDEX
- The Microchip Web Site
- Customer Change Notification Service
- Customer Support
- Reader Response
- PIC18F1220/1320 Product Identification System
- Worldwide Sales and Service
PIC18F1220/1320
DS39605F-page 160 © 2007 Microchip Technology Inc.
17.1 A/D Acquisition Requirements
For the A/D converter to meet its specified accuracy,
the charge holding capacitor (C
HOLD) must be allowed
to fully charge to the input channel voltage level. The
analog input model is shown in Figure 17-2. The
source impedance (R
S) and the internal sampling
switch (R
SS) impedance directly affect the time
required to charge the capacitor C
HOLD. The sampling
switch (R
SS) impedance varies over the device voltage
(V
DD). The source impedance affects the offset voltage
at the analog input (due to pin leakage current). The
maximum recommended impedance for analog
sources is 2.5 kΩ. After the analog input channel is
selected (changed), the channel must be sampled for
at least the minimum acquisition time before starting a
conversion.
To calculate the minimum acquisition time,
Equation 17-1 may be used. This equation assumes
that 1/2 LSb error is used (1024 steps for the A/D). The
1/2 LSb error is the maximum error allowed for the A/D
to meet its specified resolution.
Example 17-1 shows the calculation of the minimum
required acquisition time, T
ACQ. This calculation is
based on the following application system
assumptions:
C
HOLD = 120 pF
Rs = 2.5 kΩ
Conversion Error ≤ 1/2 LSb
V
DD =5V → RSS = 7 kΩ
Temperature = 50°C (system max.)
VHOLD = 0V @ time = 0
17.2 A/D VREF+ and VREF- References
If external voltage references are used instead of the
internal AV
DD and AVSS sources, the source imped-
ance of the V
REF+ and VREF- voltage sources must be
considered. During acquisition, currents supplied by
these sources are insignificant. However, during
conversion, the A/D module sinks and sources current
through the reference sources.
In order to maintain the A/D accuracy, the voltage
reference source impedances should be kept low to
reduce voltage changes. These voltage changes occur
as reference currents flow through the reference
source impedance. The maximum recommended
impedance of the V
REF+ and VREF- external
reference voltage sources is 250Ω.
EQUATION 17-1: ACQUISITION TIME
EQUATION 17-2: A/D MINIMUM CHARGING TIME
EXAMPLE 17-1: CALCULATING THE MINIMUM REQUIRED ACQUISITION TIME
Note: When the conversion is started, the
holding capacitor is disconnected from the
input pin.
TACQ = Amplifier Settling Time + Holding Capacitor Charging Time + Temperature Coefficient
=T
AMP + TC + TCOFF
VHOLD = (ΔVREF – (ΔVREF/2048)) • (1 – e
(-TC/CHOLD(RIC + RSS + RS))
)
or
T
C = -(CHOLD)(RIC + RSS + RS) ln(1/2048)
TACQ =TAMP + TC + TCOFF
TAMP =5 μs
T
COFF = (Temp – 25ºC)(0.05 μs/ºC)
(50ºC – 25ºC)(0.05 μs/ºC)
1.25 μs
Temperature coefficient is only required for temperatures > 25ºC. Below 25ºC, T
COFF = 0 μs.
T
C =-(CHOLD)(RIC + RSS + RS) ln(1/2047) μs
-(120 pF) (1 kΩ + 7 kΩ + 2.5 kΩ) ln(0.0004883) μs
9.61 μs
T
ACQ =5 μs + 1.25 μs + 9.61 μs
12.86 μs