Datasheet

 1996 Microchip Technology Inc. DS30412C-page 177
PIC17C4X
Applicable Devices 42 R42 42A 43 R43 44
19.1 DC CHARACTERISTICS: PIC17CR42/42A/43/R43/44-16 (Commercial, Industrial)
PIC17CR42/42A/43/R43/44-25 (Commercial, Industrial)
PIC17CR42/42A/43/R43/44-33 (Commercial, Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40˚C ≤ T
A ≤ +85˚C for industrial and
0˚C ≤ T
A ≤ +70˚C for commercial
Parameter
No. Sym Characteristic Min Typ† Max Units Conditions
D001 V
DD Supply Voltage 4.5 – 6.0 V
D002 V
DR RAM Data Retention
Voltage (Note 1)
1.5 * – – V Device in SLEEP mode
D003 V
POR VDD start voltage to
ensure internal
Power-on Reset signal
–VSS – V See section on Power-on Reset for
details
D004 S
VDD VDD rise rate to
ensure internal
Power-on Reset signal
0.060 * – – mV/ms See section on Power-on Reset for
details
D010
D011
D012
D013
D015
D014
I
DD Supply Current
(Note 2)
–
–
–
–
–
–
3
6
11
19
25
95
6
12 *
24 *
38
50
150
mA
mA
mA
mA
mA
µA
F
OSC = 4 MHz (Note 4)
F
OSC = 8 MHz
F
OSC = 16 MHz
F
OSC = 25 MHz
F
OSC = 33 MHz
F
OSC = 32 kHz,
WDT enabled (EC osc configuration)
D020
D021
I
PD Power-down
Current (Note 3)
–
–
10
< 1
40
5
µA
µA
VDD = 5.5V, WDT enabled
V
DD = 5.5V, WDT disabled
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
Note 1: This is the limit to which V
DD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
DD or VSS, T0CKI = VDD,
MCLR
= VDD; WDT enabled/disabled as specified.
Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads needs to be con-
sidered.
For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as: V
DD / (2 • R).
For capacitive loads, the current can be estimated (for an individual I/O pin) as (C
L • VDD) • f
C
L = Total capacitive load on the I/O pin; f = average frequency the I/O pin switches.
The capacitive currents are most significant when the device is configured for external execution (includes
extended microcontroller mode).
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula I
R = VDD/2Rext (mA) with Rext in kOhm.