Datasheet

PIC16(L)F720/721
DS40001430E-page 192  2010-2013 Microchip Technology Inc.
23.5 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature-40°C  T
A  +125°C
Param.
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance Junction to
Ambient
62.2 C/W 20-pin PDIP package
75.0 C/W 20-pin SOIC package
89.3 C/W 20-pin SSOP package
43.0 C/W 20-pin QFN 4x4mm package
TH02 
JC Thermal Resistance Junction to
Case
27.5 C/W 20-pin PDIP package
23.1 C/W 20-pin SOIC package
31.1 C/W 20-pin SSOP package
5.3 C/W 20-pin QFN 4x4mm package
TH03 T
JMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = P
INTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD -
V
OH))
TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA
(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature; TJ = Junction Temperature