Datasheet

© 2007 Microchip Technology Inc. DS41250F-page 263
PIC16F913/914/916/917/946
19.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +125°C
Param
No.
Symbol Characteristic Typ. Units Conditions
TH01 θ
JA Thermal Resistance
Junction to Ambient
60.0 °C/W 28-pin PDIP package
80.0 °C/W 28-pin SOIC package
90.0 °C/W 28-pin SSOP package
27.5 °C/W 28-pin QFN 6x6 mm package
47.2 °C/W 40-pin PDIP package
46.0 °C/W 44-pin TQFP package
24.4 °C/W 44-pin QFN 8x8 mm package
77.0 °C/W 64-pin TQFP package
TH02 θ
JC Thermal Resistance
Junction to Case
31.4 °C/W 28-pin PDIP package
24.0 °C/W 28-pin SOIC package
24.0 °C/W 28-pin SSOP package
20.0 °C/W 28-pin QFN 6x6 mm package
24.7 °C/W 40-pin PDIP package
14.5 °C/W 44-pin TQFP package
20.0 °C/W 44-pin QFN 8x8 mm package
24.4 °C/W 64-pin TQFP package
TH03 T
J Junction Temperature 150 °C For derated power calculations
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/O I/O Power Dissipation — W PI/O = Σ (IOL * VOL) + Σ (IOH * (VDD - VOH))
TH07 P
DER Derated Power — W PDER = (TJ - TA)/θJA
(NOTE 2, 3)
Note 1: I
DD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DER).