Datasheet

 2006-2012 Microchip Technology Inc. DS41291G-page 257
PIC16F882/883/884/886/887
17.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +125°C
Param
No.
Sym. Characteristic Typ. Units Conditions
TH01 
JA Thermal Resistance
Junction to Ambient
47.2 C/W 40-pin PDIP package
24.4 C/W 44-pin QFN package
45.8 C/W 44-pin TQFP package
60.2 C/W 28-pin PDIP package
80.2 C/W 28-pin SOIC package
89.4 C/W 28-pin SSOP package
29 C/W 28-pin QFN package
TH02 
JC Thermal Resistance
Junction to Case
24.7 C/W 40-pin PDIP package
20.0 C/W 44-pin QFN package
14.5 C/W 44-pin TQFP package
29 C/W 28-pin PDIP package
23.8 C/W 28-pin SOIC package
23.9 C/W 28-pin SSOP package
20.0 C/W 28-pin QFN package
TH03 T
J Junction Temperature 150 C For derated power calculations
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD
(NOTE 1)
TH06 PI/O I/O Power Dissipation — W PI/O =  (IOL * VOL) +  (IOH * (VDD -
V
OH))
TH07 PDER Derated Power — W PDER = (TJ - TA)/JA
(NOTE 2, 3)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: T
A = Ambient Temperature.
3: Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DER).