Datasheet

PIC16F87XA
DS39582C-page 218  2001-2013 Microchip Technology Inc.
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body, Punch Singulated (QFN)
Lead Width
*Controlling Parameter
Drawing No. C04-114
Notes:
Mold Draft Angle Top
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
B
α
.009
12°
.011 .014 0.23
12°
0.28 0.35
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overall Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A
.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN
28
NOM
MAX
0.65
.031
.002 0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN
28
0.65 BSC
NOM
0.80
0.05
1.00
.008 REFBase Thickness
A3
0.20 REF
JEDEC equivalent: mMO-220
0.85.033
.0004 0.01
.236 BSC
.226 BSC
6.00 BSC
5.75 BSC
Lead Length
Tie Bar Width
L .020 .024 .030 0.50 0.60 0.75
R .005 .007 .010 0.13 0.17 0.23
Tie Bar Length
Q
.012 .016 .026 0.30 0.40 0.65
Chamfer CH .009 .017 .024 0.24 0.42 0.60
E2
D2
Exposed Pad Width
Exposed Pad Length
.140 .146 .152 3.55 3.70 3.85
.140 .146 .152 3.55 3.70 3.85
D
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PADS
BOTTOM VIEW
TOP VIEW
Q
L
R
p
A1
A3
α
CH X 45°
B
D2
E2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging