Datasheet

PIC16F87XA
DS39582C-page 214  2001-2013 Microchip Technology Inc.
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
Lead Width
*Controlling Parameter
Drawing No. C04-103
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
B .012 .013 .013 0.30 0.33 0.35
Pitch
Number of Pins
Overall Width
Standoff
Overall Length
Overall Height
MAX
Units
Dimension Limits
A1
D
E
n
p
A
.315 BSC
.000
INCHES
.026 BSC
MIN
44
NOM
MAX
.002 0
8.00 BSC
MILLIMETERS*
.039
MIN
44
0.65 BSC
NOM
0.05
1.00
.010 REFBase Thickness
A3
0.25 REF
JEDEC equivalent: M0-220
0.90.035
.001 0.02
.315 BSC 8.00 BSC
Lead Length L .014 .016 .018 0.35 0.40 0.45
E2
D2
Exposed Pad Width
Exposed Pad Length
.262 .268 .274 6.65 6.80 6.95
.262 .268 .274 6.65 6.80 6.95
D2
D
A1
A3
A
TOP VIEW
n
1
L
E2
BOTTOM VIEW
B
E
2
PAD
METAL
EXPOSED
p
PIN 1
INDEX ON
EXPOSED PAD
TOP MARKING
INDEX ON
OPTIONAL PIN 1
.031 0.80
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging