Datasheet

PIC16F87X
DS30292C-page 154  2001 Microchip Technology Inc.
IPD Power-down Current
(3,5)
D020 16LF87X — 7.5 30 µAVDD = 3.0V, WDT enabled,
-40°C to +85°C
D020 16F87X — 10.5 42 µA VDD = 4.0V, WDT enabled,
-40°C to +85°C
D021 16LF87X — 0.9 5 µAV
DD = 3.0V, WDT enabled,
0°C to +70°C
D021 16F87X — 1.5 16 µA VDD = 4.0V, WDT enabled,
-40°C to +85°C
D021A 16LF87X 0.9 5 µAV
DD = 3.0V, WDT enabled,
-40°C to +85°C
D021A 16F87X 1.5 19 µA VDD = 4.0V, WDT enabled,
-40°C to +85°C
D023 ∆I
BOR Brown-out
Reset Current
(6)
— 85 200 µA BOR enabled, V
DD = 5.0V
15.1 DC Characteristics: PIC16F873/874/876/877-04 (Commercial, Industrial)
PIC16F873/874/876/877-20 (Commercial, Industrial)
PIC16LF873/874/876/877-04 (Commercial, Industrial)
(Continued)
PIC16LF873/874/876/877-04
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
0°C ≤ T
A ≤ +70°C for commercial
PIC16F873/874/876/877-04
PIC16F873/874/876/877-20
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
A ≤ +85°C for industrial
0°C ≤ T
A ≤ +70°C for commercial
Param
No.
Symbol Characteristic/
Device
Min Typ† Max Units Conditions
Legend: Rows with standard voltage device data only are shaded for improved readability.
† Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance
only, and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading, switching rate, oscillator type, internal code execution pattern and temperature also have an impact
on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
DD;
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 µA to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
6: The ∆ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the V
BOR voltage trip point is reached.