Datasheet

PIC16F872
DS30221C-page 154 © 2006 Microchip Technology Inc.
28-Lead Plastic Shrink Small Outline (SS) – 209 mil Body, 5.30 mm (SSOP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
p
B
n
D
2
1
E
c
L
A
A1
A2
φ
0.38-0.22.015-.009BLead Width
8°4°0°8°4°0°
φ
Foot Angle
0.25-0.09.010-.004
c
Lead Thickness
0.950.750.55.037.030.022LFoot Length
10.5010.209.90.413.402.390DOverall Length
5.605.305.00.220.209.197E1Molded Package Width
8.207.807.49.323.307.295EOverall Width
--0.05--.002A1Standoff
1.851.751.65.073.069.065A2Molded Package Thickness
2.00--.079--AOverall Height
0.65.026
p
Pitch
2828
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-073
*Controlling Parameter
Revised 1-12-06