Datasheet

PIC16F872
DS30221C-page 152 © 2006 Microchip Technology Inc.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1510515105
β
Mold Draft Angle Bottom
1510515105
α
Mold Draft Angle Top
10.928.898.13.430.350.320
eB
Overall Row Spacing
§
0.560.480.41.022.019.016BLower Lead Width
1.651.331.02.065.053.040B1Upper Lead Width
0.380.290.20.015.012.008
c
Lead Thickness
3.433.303.18.135.130.125LTip to Seating Plane
35.1834.6734.161.3851.3651.345DOverall Length
7.497.246.99.295.285.275E1Molded Package Width
8.267.877.62.325.310.300EShoulder to Shoulder Width
0.38.015A1Base to Seating Plane
3.433.303.18.135.130.125A2Molded Package Thickness
4.063.813.56.160.150.140ATop to Seating Plane
2.54.100
p
Pitch
2828
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES
* Units
2
1
D
n
E1
c
eB
β
E
α
p
L
A2
B
B1
A
A1
Notes:
JEDEC Equivalent: MO-095
Drawing No. C04-070
* Controlling Parameter
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
§ Significant Characteristic