Datasheet

© 2006 Microchip Technology Inc. DS30221C-page 123
PIC16F872
14.3 DC Characteristics: PIC16F872 (Extended)
PIC16F872 (Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ TA ≤ +125°C
Param
No.
Symbol Characteristic/
Device
Min Typ† Max Units Conditions
V
DD Supply Voltage
D001 4.0 — 5.5 V LP, XT, RC osc configuration
D001A 4.5 5.5 V HS osc configuration
D001A V
BOR 5.5 V BOR enabled, FMAX = 14 MHz
(7)
D002 VDR RAM Data Retention
Voltage
(1)
—1.5— V
D003 V
POR VDD Start Voltage to
ensure internal Power-on
Reset signal
—V
SS — V See section on Power-on Reset for
details
D004 S
VDD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 — — V/ms See section on Power-on Reset for
details
D005 V
BOR Brown-out Reset
Voltage
3.7 4.0 4.35 V BODEN bit in configuration word
enabled
IDD Supply Current
(2,5)
D010 — 1.6 4 mA RC osc configurations
F
OSC = 4 MHz, VDD = 5.5V
D013 — 7 15 mA HS osc configuration,
F
OSC = 20 MHZ, VDD = 5.5V
D015 ΔI
BOR Brown-out
Reset Current
(6)
— 85 200 μA BOR enabled, VDD = 5.0V
I
PD Power-down
Current
(3,5)
D020A 10.5 60 μAVDD = 4.0V, WDT enabled
D021B 1.5 30 μAVDD = 4.0V, WDT disabled
D023 ΔIBOR Brown-out
Reset Current
(6)
— 85 200 μA BOR enabled, V
DD = 5.0V
† Data in “Typ” column is at 5V, 25°C, unless otherwise stated. These parameters are for design guidance only,
and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern and temperature also have an
impact on the current consumption.
The test conditions for all I
DD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be esti-
mated by the formula Ir = V
DD/2REXT (mA) with REXT in kOhm.
5: Timer1 oscillator (when enabled) adds approximately 20 μA to the specification. This value is from charac-
terization and is for design guidance only. This is not tested.
6: The Δ current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the V
BOR voltage trip point is reached.