Datasheet

 2000-2013 Microchip Technology Inc. DS30569C-page 119
PIC16F870/871
14.1 DC Characteristics: PIC16F870/871 (Industrial, Extended)
PIC16LF870/871 (Commercial, Industrial)
PIC16LF870/871
(Commercial, Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +85°C for Industrial
0°C  T
A  +70°C for Commercial
PIC16F870/871
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
A  +85°C for Industrial
-40°C  T
A  +125°C for Extended
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
VDD Supply Voltage
D001 PIC16LF870/871 2.0 — 5.5 V All configurations. See Figure 14-2 for
details.
D001
D001A
PIC16F870/871 4.0
V
BOR*
V
BOR
—
—
—
5.5
5.5
5.5
V
V
V
All configurations.
BOR enabled, F
MAX = 14 MHz (Note 7),
-40°C to +85°C
BOR enabled, F
MAX = 10 MHz (Note 7),
-40°C to +125°C
D002* V
DR RAM Data Retention
Voltage
(1)
—1.5—V
D003 V
POR VDD Start Voltage to
ensure internal Power-on
Reset signal
— Vss — V See section on Power-on Reset for details
D004* SV
DD VDD Rise Rate to ensure
internal Power-on Reset
signal
0.05 — — V/ms See section on Power-on Reset for details
D005 V
BOR Brown-out Reset
Voltage
3.7 4.0 4.35 V BOREN bit in configuration word enabled
* These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which V
DD can be lowered without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O
pin loading and switching rate, oscillator type, internal code execution pattern and temperature also have
an impact on the current consumption.
The test conditions for all I
DD measurements in active Operation mode are:
OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to V
DD
MCLR
= VDD; WDT enabled/disabled as specified.
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
DD and VSS.
4: For RC osc configuration, current through R
EXT is not included. The current through the resistor can be
estimated by the formula Ir = V
DD/2REXT (mA) with REXT in k.
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from
characterization and is for design guidance only. This is not tested.
6: The  current is the additional current consumed when this peripheral is enabled. This current should be
added to the base I
DD or IPD measurement.
7: When BOR is enabled, the device will operate correctly until the V
BOR voltage trip point is reached.