Datasheet

 1996 Microchip Technology Inc. DS30430B-page 99
PIC16F8X
15.0 PACKAGING INFORMATION
15.1 P
ackage Marking Information
Legend: MM...M Microchip part number information
XX...X Customer specific information*
AA Year code (last two digits of calendar year)
BB Week code (week of January 1 is week ‘01’)
C Facility code of the plant at which wafer is manufactured
C = Chandler, Arizona, U.S.A.,
S = Tempe, Arizona, U.S.A.
D Mask revision number
E Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week
code, facility code, mask rev#, and assembly code. For OTP marking beyond
this, certain price adders apply. Please check with your Microchip Sales Office.
For QTP devices, any special marking adders are included in QTP price.
18L PDIP
MMMMMMMMXXXXXXXX
MMMMMMMMMMMMXXX
AABB CDE
AABB CDE
XXXXXXXX
MMMMMMMM
18L SOIC
Example
10I/P
PIC16F84
9305 CBA
9310 CBA
04I/S0218
PIC16LF84
Example
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