Datasheet

 1996 Microchip Technology Inc. DS30430B-page 121
PIC16F8X
PIC16F8X PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Suppor
t
Data Sheets
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mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office (see last page)
2. The Microchip Corporate Literature Center U.S. FAX: [phone]
3. The Microchip’s Bulletin Board, via your local CompuServe number (CompuServe membership NOT required).
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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PART NO. -XX
X /XX XXX
PatternPackageTemperature
Range
Frequency
Range
Device
Device PIC16F8X
(2)
, PIC16F8XT
(3)
PIC16LF8X
(2)
, PIC16LF8XT
(3)
PIC16CR8X
(2)
, PIC16CR8XT
(3)
PIC16LCR8X
(2)
, PIC16LCR8XT
(3)
Frequency
Range
04
10
= 4 MHz
= 10 MHz
Temperature
Range
b
(1)
I
=0°C to +70°C (Commercial)
= -40°C to +85°C (Industrial)
Package P
SO
= PDIP
= SOIC (Gull Wing, 300 mil body)
Pattern 3-digit Pattern Code for QTP, ROM (blank otherwise)
Examples:
a) PIC16F84 -04/P 301 = Commercial
temp., PDIP package, 4 MHz, normal
VDD limits, QTP pattern #301.
b) PIC16LF84 - 04I/SO = Industrial temp.,
SOIC package, 200 kHz, Extended VDD
limits.
c) PIC16CR84 - 10I/P = ROM program
memory, Industrial temp., PDIP package,
10MHz, normal VDD limits.
Note 1: b = blank
2: F = Standard VDD range
LF = Extended VDD range
CR = ROM Version, Standard VDD
range
LCR = ROM Version, Extended VDD
range
3: T = in tape and reel - SOIC, SSOP
packages only.
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