Datasheet

PIC16F8X
 1996-2013 Microchip Technology Inc. DS30430D-page 113
Package Type: K04-051 18-Lead Plastic Small Outline (SO) – Wide, 300 mil
0.014
0.009
0.010
0.011
0.005
0.005
0.010
0.394
0.292
0.450
0.004
0.048
0.093
MIN
nNumber of Pins
Mold Draft Angle Bottom
Mold Draft Angle Top
Lower Lead Width
Chamfer Distance
Outside Dimension
Molded Package Width
Molded Package Length
Overall Pack. Height
Lead Thickness
Radius Centerline
Foot Angle
Foot Length
Gull Wing Radius
Shoulder Radius
Standoff
Shoulder Height


R2
R1
E1
A2
A1
X

B
†
c
L1
L
E
‡
D
‡
A
Dimension Limits
Pitch
Units
p
1818
0
0
12
12
15
15
4
0.020
0
0.017
0.011
0.015
0.016
0.005
0.005
0.407
0.296
0.456
0.008
0.058
0.099
0.029
0.019
0.012
0.020
0.021
0.010
0.010
8
0.419
0.299
0.462
0.011
0.068
0.104
0
0
12
12
15
15
0.42
0.27
0.38
0.41
0.13
0.13
0.50
10.33
7.51
11.58
0.19
1.47
2.50
0.25
0
0.36
0.23
0.25
0.28
0.13
0.13
10.01
7.42
11.43
0.10
1.22
2.36
0.74
48
0.48
0.30
0.51
0.53
0.25
0.25
10.64
7.59
11.73
0.28
1.73
2.64
INCHES*
0.050
NOM MAX
1.27
MILLIMETERS
MIN NOM MAX
n
2
1
R2
R1
L1
L

c

X
45
°
D
p
B
E
E1

A1
A2
A
*
Controlling Parameter.
†
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging