Datasheet

PIC16F8X
DS30430D-page 112  1996-2013 Microchip Technology Inc.
Package Type: K04-007 18-Lead Plastic Dual In-line (P) – 300 mil
* Controlling Parameter.
†
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
PCB Row Spacing 0.300 7.62
Number of Pins n 18 18
Pitch p 0.100 2.54
Lower Lead Width B 0.013 0.018 0.023 0.33 0.46 0.58
Upper Lead Width B1
†
0.055 0.060 0.065 1.40 1.52 1.65
Shoulder Radius R 0.000 0.005 0.010 0.00 0.13 0.25
Lead Thickness c 0.005 0.010 0.015 0.13 0.25 0.38
Top to Seating Plane A 0.110 0.155 0.155 2.79 3.94 3.94
Top of Lead to Seating Plane A1 0.075 0.095 0.115 1.91 2.41 2.92
Base to Seating Plane A2 0.000 0.020 0.020 0.00 0.51 0.51
Tip to Seating Plane L 0.125 0.130 0.135 3.18 3.30 3.43
Package Length D
‡
0.890 0.895 0.900 22.61 22.73 22.86
Molded Package Width E
‡
0.245 0.255 0.265 6.22 6.48 6.73
Radius to Radius Width E1 0.230 0.250 0.270 5.84 6.35 6.86
Overall Row Spacing eB 0.310 0.349 0.387 7.87 8.85 9.83
Mold Draft Angle Top

5 10 15 5 10 15
Mold Draft Angle Bottom

5 10 15 5 10 15
R
n
2
1
D
E
c
eB

E1

p
A1
L
B1
B
A
A2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging